Perrine Batude

According to our database, Perrine Batude authored at least 25 papers between 2009 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration.

Tadeu Mota Frutuoso, Xavier Garros, Perrine Batude, Laurent Brunet, Joris Lacord, Benoit Sklénard, V. Lapras, Claire Fenouillet-Béranger, M. Ribotta, A. Magalhaes-Lucas, J. Kanyandekwe, R. Kies, G. Romano, Edoardo Catapano, Mikaël Cassé, Jose Lugo-Alvarez, Philippe Ferrari, Fred Gaillard

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2021

Inter-tier Coupling Analysis in Back-illuminated Monolithic 3DSI Image Sensor Pixels.

Petros Sideris, Arnaud Peizerat, Perrine Batude, Christoforos G. Theodorou, Gilles Sicard

Proceedings of the 10th International Conference on Modern Circuits and Systems Technologies, 2021

2020

M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC.

Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Romain Lemaire, Pascal Vivet, Perrine Batude, Didier Lattard

Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition, 2020

2019

Advanced 3D Technologies and Architectures for 3D Smart Image Sensors.

Pascal Vivet, Gilles Sicard, Laurent Millet, Stéphane Chevobbe, Karim Ben Chehida, Luis Angel Cubero, Monte Alegre, Maxence Bouvier, Alexandre Valentian, Maria Lepecq, Thomas Dombek, Olivier Bichler, Sébastien Thuries, Didier Lattard, Séverine Cheramy, Perrine Batude, Fabien Clermidy

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2019

2018

A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit.

François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, Didier Lattard, Sébastien Thuries, Olivier Billoint, Richard Fournel, Maud Vinet

Proceedings of the 2018 International Conference on IC Design & Technology, 2018

Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges.

Pascal Vivet, Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Didier Lattard, Edith Beigné, Perrine Batude

Proceedings of the 25th IEEE International Conference on Electronics, Circuits and Systems, 2018

2017

Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells.

Melanie Brocard, Benoît Mathieu, Jean-Philippe Colonna, Cristiano Santos, Claire Fenouillet-Béranger, Cao-Minh Vincent Lu, Gerald Cibrario, Laurent Brunet, Perrine Batude, François Andrieu, Sébastien Thuries, Olivier Billoint

Proceedings of the 2017 IEEE Computer Society Annual Symposium on VLSI, 2017

Precise EOT regrowth extraction enabling performance analysis of low temperature extension first devices.

Jessy Micout, Quentin Rafhay, Xavier Garros, Mikaël Cassé, Jean Coignus, Luca Pasini, Cao-Minh Vincent Lu, Nils Rambal, Claire Fenouillet-Béranger, Laurent Brunet, G. Romano, R. Gassilloud, Perrine Batude, Maud Vinet, Gérard Ghibaudo

Proceedings of the 47th European Solid-State Device Research Conference, 2017

Guidelines for intermediate back end of line (BEOL) for 3D sequential integration.

Claire Fenouillet-Béranger, S. Beaurepaire, Fabien Deprat, Alexandre Ayres De Sousa, Laurent Brunet, Perrine Batude, Olivier Rozeau, François Andrieu, Paul Besombes, M.-P. Samson, Bernard Previtali, F. Nemouchi, G. Rodriguez, Philippe Rodriguez, R. Famulok, Nils Rambal, Viorel Balan, Z. Saghi, V. Jousseaume, Charles-Antoine Guérin, F. Ibars, F. Proud, D. Nouguier, David Ney, V. Delaye, H. Dansas, X. Federspiel, Maud Vinet

Proceedings of the 47th European Solid-State Device Research Conference, 2017

2016

Recent advances in 3D VLSI integration.

Claire Fenouillet-Béranger, Perrine Batude, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, M.-P. Samson, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Gerald Cibrario, Maud Vinet

Proceedings of the International Conference on IC Design and Technology, 2016

Opportunities brought by sequential 3D CoolCube™ integration.

Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Guillaume Berhault, Cristiano Lopes Dos Santos, Gerald Cibrario, Fabien Clermidy, Daniel Gitlin, Olivier Faynot

Proceedings of the 46th European Solid-State Device Research Conference, 2016

Impact of intermediate BEOL technology on standard cell performances of 3D VLSI.

Melanie Brocard, Guillaume Berhault, Sébastien Thuries, Fabien Clermidy, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, François Andrieu, Fabien Deprat, Joris Lacord, Olivier Rozeau, Gerald Cibrario, Olivier Billoint

Proceedings of the 46th European Solid-State Device Research Conference, 2016

Towards high density 3D interconnections.

Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges.

Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, Ogun Turkyilmaz, Sébastien Thuries, Fabien Clermidy

Proceedings of the 2015 Symposium on International Symposium on Physical Design, ISPD 2015, Monterey, CA, USA, March 29, 2015

A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool.

Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, A. Fustier, Julien Michallet, Olivier Faynot, Ogun Turkyilmaz, Jean-Frédéric Christmann, Sébastien Thuries, Fabien Clermidy

Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, 2015

Intermediate BEOL process influence on power and performance for 3DVLSI.

Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Deprat, Alexandre Ayres De Sousa, Perrine Batude, Claire Fenouillet-Béranger, Fabien Clermidy

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration.

Claire Fenouillet-Béranger, Bernard Previtali, Perrine Batude, F. Nemouchi, Mikaël Cassé, Xavier Garros, L. Tosti, Nils Rambal, Dominique Lafond, H. Dansas, L. Pasini, Laurent Brunet, Fabien Deprat, M. Gregoire, M. Mellier, Maud Vinet

Proceedings of the 44th European Solid State Device Research Conference, 2014

3D FPGA using high-density interconnect Monolithic Integration.

Ogun Turkyilmaz, Gerald Cibrario, Olivier Rozeau, Perrine Batude, Fabien Clermidy

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2014

2013

Cell transformations and physical design techniques for 3D monolithic integrated circuits.

Shashikanth Bobba, Ashutosh Chakraborty, Olivier Thomas, Perrine Batude, Giovanni De Micheli

ACM J. Emerg. Technol. Comput. Syst., 2013

2012

3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS.

Perrine Batude, Thomas Ernst, Julien Arcamone, Gregory Arndt, Perceval Coudrain, Pierre-Emmanuel Gaillardon

IEEE J. Emerg. Sel. Topics Circuits Syst., 2012

Analytical modeling of parasitics in monolithically integrated 3D inverters.

Joris Lacord, Perrine Batude, Gérard Ghibaudo, Frédéric Boeuf

Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011

3D monolithic integration.

Perrine Batude, Maud Vinet, Arnaud Pouydebasque, Cyrille Le Royer, Bernard Previtali, Claude Tabone, Jean-Michel Hartmann, Loic Sanchez, Laurence Baud, Veronique Carron, Alain Toffoli, Fabienne Allain, Vincent Mazzocchi, Dominique Lafond, Simon Deleonibus, Olivier Faynot

Proceedings of the International Symposium on Circuits and Systems (ISCAS 2011), 2011

CELONCEL: Effective design technique for 3-D monolithic integration targeting high performance integrated circuits.

Shashikanth Bobba, Ashutosh Chakraborty, Olivier Thomas, Perrine Batude, Thomas Ernst, Olivier Faynot, David Z. Pan, Giovanni De Micheli

Proceedings of the 16th Asia South Pacific Design Automation Conference, 2011

2010

Performance analysis of 3-D monolithic integrated circuits.

Shashikanth Bobba, Ashutosh Chakraborty, Olivier Thomas, Perrine Batude, Vasilis F. Pavlidis, Giovanni De Micheli

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

System on Wafer: A New Silicon Concept in SiP.

Gilles Poupon, Nicolas Sillon, David Henry, Charlotte Gillot, Alan Mathewson, Léa Di Cioccio, Barbara Charlet, Patrick Leduc, Maud Vinet, Perrine Batude

Proc. IEEE, 2009