Wen-Sheng Zhao
Orcid: 0000-0002-2507-5776Affiliations:
- Hangzhou Dianzi University, Hangzhou, China
According to our database1,
Wen-Sheng Zhao
authored at least 35 papers
between 2014 and 2025.
Collaborative distances:
Collaborative distances:
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Bibliography
2025
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., August, 2025
A Thermal and Power Integrity Co-Optimization Framework for 2.5-D Integrated Microsystem.
IEEE Trans. Circuits Syst. I Regul. Pap., March, 2025
Automated Topology Synthesis of Analog Integrated Circuits With Frequency Compensation.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., March, 2025
Proper Orthogonal Decomposition and Long Short-Term Memory Neural Network-Based Multiphysics Digital Twin Model for Electronic Device Online Condition Monitoring.
IEEE Trans. Instrum. Meas., 2025
Microelectron. J., 2025
Numerical investigation on buried gate and drift region with P-type blocks in trench SOI LDMOS.
Microelectron. J., 2025
A Differential Coupled-Line-Based Active Microwave Sensor System for Retrieving Real Permittivity of Binary Aqueous Solution.
IEEE Access, 2025
2024
IEEE Trans. Very Large Scale Integr. Syst., August, 2024
An Absorptive Common-Mode Suppression Filter Based on Resistor-Loaded M-Type Structure.
IEEE Trans. Circuits Syst. II Express Briefs, July, 2024
Ultrasensitive Edible Oil Sensor Based on Spiral SLSP Combined With Stepped Structure.
IEEE Trans. Instrum. Meas., 2024
An improved 4H-SiC trench MOS barrier Schottky diode with current spreading layer and low resistance layer.
Microelectron. J., 2024
Modeling and signal integrity analysis of silicon interposer channels based on MTL and KBNN.
Microelectron. J., 2024
IEEE Geosci. Remote. Sens. Lett., 2024
2022
IEEE Trans. Ind. Electron., 2022
Symmetry, 2022
Sensors, 2022
Fabrication and high-frequency characterization of low-cost fan-in/out WLP technology with RDL for 2.5D/3D heterogeneous integration.
Microelectron. J., 2022
2021
On the applicability of two-bit carbon nanotube through-silicon via for power distribution networks in 3-D integrated circuits.
IET Circuits Devices Syst., 2021
IEEE Access, 2021
2020
A Characterization of the Performance of Gas Sensor Based on Heater in Different Gas Flow Rate Environments.
IEEE Trans. Ind. Informatics, 2020
Fully coupled electrothermal simulation of resistive random access memory (RRAM) array.
Sci. China Inf. Sci., 2020
IEEE Access, 2020
2019
IEEE Trans. Ind. Informatics, 2019
Sensors, 2019
Repeater Insertion to Reduce Delay and Power in Copper and Carbon Nanotube-Based Nanointerconnects.
IEEE Access, 2019
An Improved Algorithm for Drift Diffusion Transport and Its Application on Large Scale Parallel Simulation of Resistive Random Access Memory Arrays.
IEEE Access, 2019
IEEE Access, 2019
2018
Design of a Novel Miniaturized Frequency Selective Surface Based on 2.5-Dimensional Jerusalem Cross for 5G Applications.
Wirel. Commun. Mob. Comput., 2018
Sensors, 2018
IEEE Access, 2018
Modeling and Performance Analysis of Shielded Differential Annular Through-Silicon Via (SD-ATSV) for 3-D ICs.
IEEE Access, 2018
2017
A comparative study on electrothermal characteristics of nanoscale multiple gate MOSFETs.
Microelectron. Reliab., 2017
IEEE Access, 2017
2014
Investigation on thermo-mechanical responses in high power multi-finger AlGaN/GaN HEMTs.
Microelectron. Reliab., 2014