Xianrui Dou

According to our database, Xianrui Dou authored at least 4 papers between 2024 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Prebond Test of TSV Based on Voltage Skew Amplification.

Xianrui Dou, Huaguo Liang, Zhengfeng Huang, Yingchun Lu, Yue Wang, Tian Chen, Jun Liu

IEEE Trans. Circuits Syst. II Express Briefs, November, 2025

A TSV Misalignment-Based Repair Architecture in 3-D Chips.

Huaguo Liang, Jiahui Xiao, Xianrui Dou, Tianming Ni, Yingchun Lu, Zhengfeng Huang

IEEE Trans. Very Large Scale Integr. Syst., July, 2025

Pulse-Based Prebond TSV Testing.

Xianrui Dou, Huaguo Liang, Zhengfeng Huang, Yingchun Lu, Tian Chen, Maoxiang Yi

IEEE Trans. Very Large Scale Integr. Syst., May, 2025

2024

Machine Learning-Based Diagnosis of Defects in Chiplet Interconnects.

Junming Li, Huaguo Liang, Xianrui Dou, Le Yu, Zhengfeng Huang, Yingchun Lu, Cuiyun Jiang

Proceedings of the International 3D Systems Integration Conference, 2024