Shengcheng Wang

According to our database, Shengcheng Wang authored at least 14 papers between 2014 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

COMB-MCM: Computing-on-Memory-Boundary NN Processor with Bipolar Bitwise Sparsity Optimization for Scalable Multi-Chiplet-Module Edge Machine Learning.

Haozhe Zhu, Bo Jiao, Jinshan Zhang, Xinru Jia, Yunzhengmao Wang, Tianchan Guan, Shengcheng Wang, Dimin Niu, Hongzhong Zheng, Chixiao Chen, Mingyu Wang, Lihua Zhang, Xiaoyang Zeng, Qi Liu, Yuan Xie, Ming Liu

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2019

Defect Clustering-Aware Spare-TSV Allocation in 3-D ICs for Yield Enhancement.

Shengcheng Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019

2018

Reliable Design of Three-Dimensional Integrated Circuits

Shengcheng Wang

PhD thesis, 2018

Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs.

Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori

IEEE Trans. Very Large Scale Integr. Syst., 2018

Multicast Testing of Interposer-Based 2.5D ICs: Test-Architecture Design and Test Scheduling.

Shengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori

ACM Trans. Design Autom. Electr. Syst., 2018

2017

Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs.

Shengcheng Wang, Mehdi Baradaran Tahoori

IEEE Trans. Very Large Scale Integr. Syst., 2017

Leveraging recovery effect to reduce electromigration degradation in power/ground TSV.

Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori

Proceedings of the 2017 IEEE/ACM International Conference on Computer-Aided Design, 2017

Recovery-aware proactive TSV repair for electromigration in 3D ICs.

Shengcheng Wang, Hengyang Zhao, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2017

2016

Thermal-aware TSV repair for electromigration in 3D ICs.

Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty

Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition, 2016

Multicast Test Architecture and Test Scheduling for Interposer-Based 2.5D ICs.

Shengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori

Proceedings of the 25th IEEE Asian Test Symposium, 2016

2015

Deadspace-aware Power/Ground TSV planning in 3D floorplanning.

Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori

Proceedings of the 2015 International Conference on IC Design & Technology, 2015

Defect Clustering-Aware Spare-TSV Allocation for 3D ICs.

Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2015

Stress-aware P/G TSV planning in 3D-ICs.

Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori

Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015

2014

P/G TSV planning for IR-drop reduction in 3D-ICs.

Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2014