Dylan C. Stow

According to our database, Dylan C. Stow authored at least 13 papers between 2012 and 2019.

Collaborative distances:

• Dijkstra number of three.
• Erdős number of four.

2019

Network-on-Chip Design Guidelines for Monolithic 3-D Integration.

Itir Akgun, Dylan C. Stow, Yuan Xie

IEEE Micro, 2019

Power Profiling of Modern Die-Stacked Memory.

Dylan C. Stow, Amin Farmahini Farahani, Sudhanva Gurumurthi, Michael Ignatowski, Yuan Xie

IEEE Comput. Archit. Lett., 2019

Investigation of Cost-Optimal Network-on-Chip for Passive and Active Interposer Systems.

Dylan C. Stow, Itir Akgun, Yuan Xie

Proceedings of the 21st ACM/IEEE International Workshop on System Level Interconnect Prediction, 2019

Efficient System Architecture in the Era of Monolithic 3D: Dynamic Inter-tier Interconnect and Processing-in-Memory.

Dylan C. Stow, Itir Akgun, Wenqin Huangfu, Yuan Xie, Xueqi Li, Gabriel H. Loh

Proceedings of the 56th Annual Design Automation Conference 2019, 2019

2018

Die Stacking Is Happening.

Xing Hu, Dylan C. Stow, Yuan Xie

IEEE Micro, 2018

Cost-efficient 3D Integration to Hinder Reverse Engineering During and After Manufacturing.

Peng Gu, Dylan C. Stow, Prashansa Mukim, Shuangchen Li, Yuan Xie

Proceedings of the Asian Hardware Oriented Security and Trust Symposium, 2018

2017

Cost-effective design of scalable high-performance systems using active and passive interposers.

Dylan C. Stow, Yuan Xie, Taniya Siddiqua, Gabriel H. Loh

Proceedings of the 2017 IEEE/ACM International Conference on Computer-Aided Design, 2017

Security Threats and Countermeasures in Three-Dimensional Integrated Circuits.

Jaya Dofe, Peng Gu, Dylan C. Stow, Qiaoyan Yu, Eren Kursun, Yuan Xie

Proceedings of the on Great Lakes Symposium on VLSI 2017, 2017

2016

Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space.

Dylan C. Stow, Itir Akgun, Russell Barnes, Peng Gu, Yuan Xie

Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2016

Thermal-aware 3D design for side-channel information leakage.

Peng Gu, Dylan C. Stow, Russell Barnes, Eren Kursun, Yuan Xie

Proceedings of the 34th IEEE International Conference on Computer Design, 2016

Cost analysis and cost-driven IP reuse methodology for SoC design based on 2.5D/3D integration.

Dylan C. Stow, Itir Akgun, Russell Barnes, Peng Gu, Yuan Xie

Proceedings of the 35th International Conference on Computer-Aided Design, 2016

Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges.

Peng Gu, Shuangchen Li, Dylan C. Stow, Russell Barnes, Liu Liu, Yuan Xie, Eren Kursun

Proceedings of the 26th edition on Great Lakes Symposium on VLSI, 2016

2012

Yield-driven minimum energy CMOS cell design.

Max A. Korbel, Dylan C. Stow, Chris R. Ferguson, David Money Harris

Proceedings of the Conference Record of the Forty Sixth Asilomar Conference on Signals, 2012