Mike Ignatowski

According to our database1, Mike Ignatowski authored at least 22 papers between 2001 and 2023.

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Bibliography

2023

2019
Power Profiling of Modern Die-Stacked Memory.
IEEE Comput. Archit. Lett., 2019

Co-ML: a case for <u>co</u>llaborative <u>ML</u> acceleration using near-data processing.
Proceedings of the International Symposium on Memory Systems, 2019

2018
Challenges of High-Capacity DRAM Stacks and Potential Directions.
Proceedings of the Workshop on Memory Centric High Performance Computing, 2018

2017
Exploring the Processing-in-Memory design space.
J. Syst. Archit., 2017


2015
Achieving Exascale Capabilities through Heterogeneous Computing.
IEEE Micro, 2015

Memory organizations for 3D-DRAMs and PCMs in processor memory hierarchy.
J. Syst. Archit., 2015

Heterogeneous memory architectures: A HW/SW approach for mixing die-stacked and off-package memories.
Proceedings of the 21st IEEE International Symposium on High Performance Computer Architecture, 2015

NMI: A new memory interface to enable innovation.
Proceedings of the 2015 IEEE Hot Chips 27 Symposium (HCS), 2015

Processing-in-Memory: Exploring the Design Space.
Proceedings of the Architecture of Computing Systems - ARCS 2015, 2015

2014
Toward efficient programmer-managed two-level memory hierarchies in exascale computers.
Proceedings of the 1st International Workshop on Hardware-Software Co-Design for High Performance Computing, 2014

TOP-PIM: throughput-oriented programmable processing in memory.
Proceedings of the 23rd International Symposium on High-Performance Parallel and Distributed Computing, 2014

Improving Node-Level MapReduce Performance Using Processing-in-Memory Technologies.
Proceedings of the Euro-Par 2014: Parallel Processing Workshops, 2014

3D DRAM and PCMs in Processor Memory Hierarchy.
Proceedings of the Architecture of Computing Systems - ARCS 2014, 2014

2013
A new perspective on processing-in-memory architecture design.
Proceedings of the ACM SIGPLAN Workshop on Memory Systems Performance and Correctness, 2013

A Multi-core Memory Organization for 3-D DRAM as Main Memory.
Proceedings of the Architecture of Computing Systems - ARCS 2013, 2013

2012
New Memory Organizations for 3D DRAM and PCMs.
Proceedings of the Architecture of Computing Systems - ARCS 2012 - 25th International Conference, Munich, Germany, February 28, 2012

2008
Technology, CAD tools, and designs for emerging 3D integration technology.
Proceedings of the 18th ACM Great Lakes Symposium on VLSI 2008, 2008

2007
Interconnects in the Third Dimension: Design Challenges for 3D ICs.
Proceedings of the 44th Design Automation Conference, 2007

2005
Exploitation of optical interconnects in future server architectures.
IBM J. Res. Dev., 2005

2001
Analytical analysis of finite cache penalty and cycles per instruction of a multiprocessor memory hierarchy using miss rates and queuing theory.
IBM J. Res. Dev., 2001


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