Ningmei Yu

According to our database1, Ningmei Yu authored at least 40 papers between 2014 and 2022.

Collaborative distances:



In proceedings 
PhD thesis 




A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application.
IEEE Trans. Very Large Scale Integr. Syst., 2022

A 56-Gb/s Reconfigurable Silicon-Photonics Transmitter Using High-Swing Distributed Driver and 2-Tap In-Segment Feed-Forward Equalizer in 65-nm CMOS.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022

Design of a PAM-4 VCSEL-Based Transceiver Front-End for Beyond-400G Short-Reach Optical Interconnects.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022

Compact high-performance dual-frequency power divider based on TSV.
Microelectron. J., 2022

A self-compensated approach for ramp kickback noise in CMOS image sensor column parallel single slope ADC.
Microelectron. J., 2022

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line.
IEICE Electron. Express, 2022

TSV-based SIW bandpass filter for W-band mobile communication applications.
IEICE Electron. Express, 2022

A wireless multi-channel low-cost lab-on-chip algae culture monitor AIoT system for algae farm.
Comput. Electron. Agric., 2022

Design of 0-15 GHz flat-bandwidth programmable gain amplifier based on transconductance switching technique.
Microelectron. J., 2021

A transformer with high coupling coefficient and small area based on TSV.
Integr., 2021

TSV-based hairpin bandpass filter for 6G mobile communication applications.
IEICE Electron. Express, 2021

Compact TSV-Based Hairpin Bandpass Filter for Thz Applications.
IEEE Access, 2021

100Gb/s PAM-4 VCSEL Driver and TIA for Short-Reach 400G-1.6T Optical Interconnects.
Proceedings of the IEEE Asia Pacific Conference on Circuit and Systems, 2021

Dynamic equalization and fast settling based wide operating voltage range 93 ​dB PSRR PTAT current reference.
Microelectron. J., 2020

Efficient Salient Object Detection Model with Dilated Convolutional Networks.
IEICE Trans. Inf. Syst., 2020

Supporting Predictable Performance Guarantees for SMT Processors.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2020

Which Metric Is Suitable for Evaluating Your Multi-Threading Processors? In Terms of Throughput, Fairness, and Predictability.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2020

An improved segmented DAC for column readout circuit correction of large array CMOS image sensor.
IEICE Electron. Express, 2020

A synchronous driving approach based on adaptive delay phase-locked loop for stitching CMOS image sensor.
IEICE Electron. Express, 2020

Methodology of Noise Flatness Based on Network Quality Factor in RF Wideband Applications.
Circuits Syst. Signal Process., 2020

An Intelligent Low-Power Low-Cost Mobile Lab-On-Chip Yeast Cell Culture Platform.
IEEE Access, 2020

A Quantized CNN-Based Microfluidic Lensless-Sensing Mobile Blood-Acquisition and Analysis System.
Sensors, 2019

Recognition of Moving Object in High Dynamic Scene for Visual Prosthesis.
IEICE Trans. Inf. Syst., 2019

Investigation on impact of substrate on low-pass filter based on coaxial TSV.
IEICE Electron. Express, 2019

A high-pass filter based on through-silicon via (TSV).
IEICE Electron. Express, 2019

QoSMT: supporting precise performance control for simultaneous multithreading architecture.
Proceedings of the ACM International Conference on Supercomputing, 2019

Statically triggered 3×VDD-Tolerant ESD detection circuit in a 90-nm low-voltage CMOS process.
Microelectron. J., 2018

A novel guard method of through-silicon-via (TSV).
IEICE Electron. Express, 2018

Q-Learning-Based Voltage-Swing Tuning and Compensation for 2.5-D Memory-Logic Integration.
IEEE Des. Test, 2018

Classification of White Blood Cells by Convolution Neural Network in Lens-Free Imaging System.
Proceedings of the 11th International Congress on Image and Signal Processing, 2018

Nonlinear CMOS Image Sensor with SOC Integrated Local Contrast Stretch for Bio-Microfluidic Imaging.
Proceedings of the 18th IEEE International Conference on Bioinformatics and Bioengineering, 2018

Study on the Channel Characteristics of Auxiliary Medical Devices Based on MDAPSK Technology.
Proceedings of the 18th IEEE International Conference on Bioinformatics and Bioengineering, 2018

An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias.
IEEE Trans. Very Large Scale Integr. Syst., 2017

Equivalent circuit model of through-silicon-via in slow wave mode.
IEICE Electron. Express, 2017

Explicit model of thermal stress induced by annular through-silicon-via (TSV).
IEICE Electron. Express, 2016

Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC).
IEICE Electron. Express, 2016

Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon.
IEICE Electron. Express, 2015

Study on thermal stress and keep-out zone induced by Cu and SiO<sub>2</sub> filled coaxial-annular through-silicon via.
IEICE Electron. Express, 2015

A 2.5-D Memory-Logic Integration With Data-Pattern-Aware Memory Controller.
IEEE Des. Test, 2015

An energy-efficient 2.5D through-silicon interposer I/O with self-adaptive adjustment of output-voltage swing.
Proceedings of the International Symposium on Low Power Electronics and Design, 2014