Ningmei Yu

According to our database¹, Ningmei Yu authored at least 51 papers between 2014 and 2024.

Collaborative distances:

Dijkstra number² of three.
Erdős number³ of four.

Timeline

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In proceedings

Article

PhD thesis

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On csauthors.net:

Bibliography

2024

Synchronous Driving Method for Stitching Pixel Arrays Based on an Adaptive Correction Technique.

[BibT_eX]

[DOI]

Sensors, March, 2024

A compact fifth-order SIW BPF based on TSV technology with high selectivity.

[BibT_eX]

[DOI]

Microelectron. J., February, 2024

2023

High Dynamic Pixel Structure Based on an Adaptive Integrating Capacitor.

[BibT_eX]

[DOI]

Sensors, November, 2023

High-Speed Fully Differential Two-Step ADC Design Method for CMOS Image Sensor.

[BibT_eX]

[DOI]

Sensors, January, 2023

High-Linearity and High-Speed ROIC of Ultra-Large Array Infrared Detectors Based on Adaptive Compensation and Enhancement.

[BibT_eX]

[DOI]

Sensors, 2023

Miniaturized silicon-based substrate integrated waveguide filter for 6G applications.

[BibT_eX]

[DOI]

Microelectron. J., 2023

Research on Dual-Line Array Subpixel Scanning Imaging for IoMT-Based Blood Cell Analysis System.

[BibT_eX]

[DOI]

IEEE Internet Things J., 2023

A high-speed 13-bit two-step single-slope ADC for large array CMOS image sensors.

[BibT_eX]

[DOI]

Integr., 2023

TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2023

2022

A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application.

[BibT_eX]

[DOI]

IEEE Trans. Very Large Scale Integr. Syst., 2022

A 56-Gb/s Reconfigurable Silicon-Photonics Transmitter Using High-Swing Distributed Driver and 2-Tap In-Segment Feed-Forward Equalizer in 65-nm CMOS.

[BibT_eX]

[DOI]

IEEE Trans. Circuits Syst. I Regul. Pap., 2022

Design of a PAM-4 VCSEL-Based Transceiver Front-End for Beyond-400G Short-Reach Optical Interconnects.

[BibT_eX]

[DOI]

IEEE Trans. Circuits Syst. I Regul. Pap., 2022

Compact high-performance dual-frequency power divider based on TSV.

[BibT_eX]

[DOI]

Microelectron. J., 2022

A self-compensated approach for ramp kickback noise in CMOS image sensor column parallel single slope ADC.

[BibT_eX]

[DOI]

Zhongjie Guo

Ningmei Yu

Longsheng Wu

Microelectron. J., 2022

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2022

TSV-based SIW bandpass filter for W-band mobile communication applications.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2022

A wireless multi-channel low-cost lab-on-chip algae culture monitor AIoT system for algae farm.

[BibT_eX]

[DOI]

Comput. Electron. Agric., 2022

2021

Design of 0-15 GHz flat-bandwidth programmable gain amplifier based on transconductance switching technique.

[BibT_eX]

[DOI]

Kai Jing

Chunlong Ji

Ningmei Yu

Microelectron. J., 2021

A transformer with high coupling coefficient and small area based on TSV.

[BibT_eX]

[DOI]

Integr., 2021

TSV-based hairpin bandpass filter for 6G mobile communication applications.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2021

Compact TSV-Based Hairpin Bandpass Filter for Thz Applications.

[BibT_eX]

[DOI]

IEEE Access, 2021

100Gb/s PAM-4 VCSEL Driver and TIA for Short-Reach 400G-1.6T Optical Interconnects.

[BibT_eX]

[DOI]

Proceedings of the IEEE Asia Pacific Conference on Circuit and Systems, 2021

2020

Dynamic equalization and fast settling based wide operating voltage range 93 dB PSRR PTAT current reference.

[BibT_eX]

[DOI]

Microelectron. J., 2020

Efficient Salient Object Detection Model with Dilated Convolutional Networks.

[BibT_eX]

[DOI]

IEICE Trans. Inf. Syst., 2020

Supporting Predictable Performance Guarantees for SMT Processors.

[BibT_eX]

[DOI]

IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2020

Which Metric Is Suitable for Evaluating Your Multi-Threading Processors? In Terms of Throughput, Fairness, and Predictability.

[BibT_eX]

[DOI]

Xin Jin

Ningmei Yu

IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2020

An improved segmented DAC for column readout circuit correction of large array CMOS image sensor.

[BibT_eX]

[DOI]

Zhongjie Guo

Ningmei Yu

Longsheng Wu

IEICE Electron. Express, 2020

A synchronous driving approach based on adaptive delay phase-locked loop for stitching CMOS image sensor.

[BibT_eX]

[DOI]

Zhongjie Guo

Ningmei Yu

Longsheng Wu

IEICE Electron. Express, 2020

Methodology of Noise Flatness Based on Network Quality Factor in RF Wideband Applications.

[BibT_eX]

[DOI]

Circuits Syst. Signal Process., 2020

An Intelligent Low-Power Low-Cost Mobile Lab-On-Chip Yeast Cell Culture Platform.

[BibT_eX]

[DOI]

IEEE Access, 2020

Hardware Trojans detection based on BP neural network.

[BibT_eX]

[DOI]

Proceedings of the 2020 IEEE International Conference on Integrated Circuits, 2020

A 28GBaud High-Swing Linear Mach-Zehnder Modulators Driver for PAM-4 and Coherent Optical Communications.

[BibT_eX]

[DOI]

Proceedings of the 2020 IEEE International Conference on Integrated Circuits, 2020

2019

A Quantized CNN-Based Microfluidic Lensless-Sensing Mobile Blood-Acquisition and Analysis System.

[BibT_eX]

[DOI]

Sensors, 2019

Recognition of Moving Object in High Dynamic Scene for Visual Prosthesis.

[BibT_eX]

[DOI]

IEICE Trans. Inf. Syst., 2019

Investigation on impact of substrate on low-pass filter based on coaxial TSV.

[BibT_eX]

[DOI]

Fengjuan Wang

He Li

Ningmei Yu

IEICE Electron. Express, 2019

A high-pass filter based on through-silicon via (TSV).

[BibT_eX]

[DOI]

Fengjuan Wang

Jia Huang

Ningmei Yu

IEICE Electron. Express, 2019

QoSMT: supporting precise performance control for simultaneous multithreading architecture.

[BibT_eX]

[DOI]

Proceedings of the ACM International Conference on Supercomputing, 2019

2018

Statically triggered 3×VDD-Tolerant ESD detection circuit in a 90-nm low-voltage CMOS process.

[BibT_eX]

[DOI]

Microelectron. J., 2018

A novel guard method of through-silicon-via (TSV).

[BibT_eX]

[DOI]

Fengjuan Wang

Jia Huang

Ningmei Yu

IEICE Electron. Express, 2018

Q-Learning-Based Voltage-Swing Tuning and Compensation for 2.5-D Memory-Logic Integration.

[BibT_eX]

[DOI]

Dongjun Xu

Ningmei Yu

Hantao Huang

Sai Manoj Pudukotai Dinakarrao

Hao Yu

IEEE Des. Test, 2018

Classification of White Blood Cells by Convolution Neural Network in Lens-Free Imaging System.

[BibT_eX]

[DOI]

Yuan Fang

Ningmei Yu

Yi Liu

Proceedings of the 11th International Congress on Image and Signal Processing, 2018

Nonlinear CMOS Image Sensor with SOC Integrated Local Contrast Stretch for Bio-Microfluidic Imaging.

[BibT_eX]

[DOI]

Proceedings of the 18th IEEE International Conference on Bioinformatics and Bioengineering, 2018

Study on the Channel Characteristics of Auxiliary Medical Devices Based on MDAPSK Technology.

[BibT_eX]

[DOI]

Xueping Li

Yuan Yu

Ningmei Yu

Proceedings of the 18th IEEE International Conference on Bioinformatics and Bioengineering, 2018

2017

An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias.

[BibT_eX]

[DOI]

Fengjuan Wang

Ningmei Yu

IEEE Trans. Very Large Scale Integr. Syst., 2017

Equivalent circuit model of through-silicon-via in slow wave mode.

[BibT_eX]

[DOI]

Fengjuan Wang

Gang Wang

Ningmei Yu

IEICE Electron. Express, 2017

2016

Explicit model of thermal stress induced by annular through-silicon-via (TSV).

[BibT_eX]

[DOI]

Fengjuan Wang

Ningmei Yu

IEICE Electron. Express, 2016

Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC).

[BibT_eX]

[DOI]

Fengjuan Wang

Ningmei Yu

IEICE Electron. Express, 2016

2015

Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2015

Study on thermal stress and keep-out zone induced by Cu and SiO<sub>2</sub> filled coaxial-annular through-silicon via.

[BibT_eX]

[DOI]

Fengjuan Wang

Ningmei Yu

IEICE Electron. Express, 2015

A 2.5-D Memory-Logic Integration With Data-Pattern-Aware Memory Controller.

[BibT_eX]

[DOI]

IEEE Des. Test, 2015

2014

An energy-efficient 2.5D through-silicon interposer I/O with self-adaptive adjustment of output-voltage swing.

[BibT_eX]

[DOI]

Dongjun Xu

Sai Manoj Pudukotai Dinakarrao

Hantao Huang

Ningmei Yu

Hao Yu

Proceedings of the International Symposium on Low Power Electronics and Design, 2014

Ningmei Yu

Timeline

Legend:

Links

On csauthors.net:

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