Greet Verbinnen

According to our database1, Greet Verbinnen authored at least 3 papers between 2009 and 2012.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2012
Fabrication and successful in-vivo implantation of a flexible neural implant with a hybrid polyimide-silicon design.
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2012

2011
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009


  Loading...