Jacopo Iannacci

Orcid: 0000-0001-6462-4814

Affiliations:
  • Fondazione Bruno Kessler, Trento, Italy


According to our database1, Jacopo Iannacci authored at least 27 papers between 2007 and 2023.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
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PhD thesis 
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Online presence:

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Bibliography

2023
MEMS-Switched Triangular and U-Shaped Band-Stop Resonators for K-Band Operation.
Sensors, October, 2023

Triangular Sierpinski Microwave Band-Stop Resonators for K-Band Filtering.
Sensors, October, 2023

Modelling, Validation and Experimental Analysis of Diverse RF-MEMS Ohmic Switch Designs in View of Beyond-5G, 6G and Future Networks - Part 1.
Sensors, April, 2023

Design of U-Shaped Frequency Tunable Microwave Filters in MEMS Technology.
Sensors, 2023

A Perspective Vision of Micro/Nano Systems and Technologies as Enablers of 6G, Super-IoT, and Tactile Internet.
Proc. IEEE, 2023

2022
A Reconfigurable Pseudohairpin Filter Based on MEMS Switches.
Sensors, 2022

Enhanced Robustness of a Bridge-Type Rf-Mems Switch for Enabling Applications in 5G and 6G Communications.
Sensors, 2022

Review and Perspectives of Micro/Nano Technologies as Key-Enablers of 6G.
IEEE Access, 2022

A Vision of 6G from the Perspective of Low-Complexity Hardware Micro/Nano Components.
Proceedings of the International Symposium on Networks, Computers and Communications, 2022

A Supra-Disciplinary Open Framework of Knowledge to Address the Future Challenges of a Network of Feelings.
Proceedings of the 2022 IEEE Future Networks World Forum, 2022

2021
The WEAF Mnecosystem: a Perspective of MEMS/NEMS Technologies as Pillars of Future 6G, Super-IoT and Tactile Internet.
Proceedings of the IEEE International Conference on Smart Internet of Things, 2021

Towards Future 6G from the Hardware Components Perspective - A Focus on the Hardware-Software Divide, its Limiting Factors and the Envisioned Benefits in Going Beyond it.
Proceedings of the 4th IEEE 5G World Forum, 2021

2020
Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems.
Sensors, 2020

RF-MEMS Monolithic K and Ka Band Multi-State Phase Shifters as Building Blocks for 5G and Internet of Things (IoT) Applications.
Sensors, 2020

Distributed Sensing Via Inductively Coupled Single-Transistor Chaotic Oscillators: A New Approach and Its Experimental Proof-of-Concept.
IEEE Access, 2020

2017
Smoothing the way towards miniaturized MEMS AlN-based piezoelectric transformers.
Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017

RF-MEMS technology: An enabling solution in the transition from 4G-LTE to 5G mobile applications.
Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017

2016
RF-MEMS for 5G mobile communications: A basic attenuator module demonstrated up to 50 GHz.
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016

A novel toggle-type MEMS vibration energy harvester for Internet of Things applications.
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016

2015
Reliability of MEMS: A perspective on failure mechanisms, improvement solutions and best practices at development level.
Displays, 2015

2012
Modeling and simulation of an active restoring mechanism for high reliability switches in RF-MEMS technology.
Microelectron. Reliab., 2012

2011
An active heat-based restoring mechanism for improving the reliability of RF-MEMS switches.
Microelectron. Reliab., 2011

MEMS technology for RF passive components.
Proceedings of the 4th International Symposium on Applied Sciences in Biomedical and Communication Technologies, 2011

2010
Enhancement of RF-MEMS switch reliability through an active anti-stiction heat-based mechanism.
Microelectron. Reliab., 2010

2009
A MEMS reconfigurable quad-band Class-E Power Amplifier for GSM standard.
Proceedings of the Design, Automation and Test in Europe, 2009

2008
A Fully Parameterized Fem Model for Electromagnetic Optimization of an RF Mems Wafer Level Package
CoRR, 2008

2007
Parasitic Effects Reduction for Wafer-Level Packaging of RF-Mems
CoRR, 2007


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