Jaesung Ahn

According to our database, Jaesung Ahn authored at least 10 papers between 2009 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2026

Design and Control of a Novel Hybrid Typed Outdoor Mobile Robot Platform: MobED.

Hun Keon Ko, Daekeun Yoon, Myeongsoo Kim, Jaesung Ahn, Taeyu Kim, Geunsang Yu, Dong Jin Hyun

IEEE Robotics Autom. Lett., March, 2026

2025

Controllable Feature Whitening for Hyperparameter-Free Bias Mitigation.

Yooshin Cho, Hanbyel Cho, Janghyeon Lee, Hyeong Gwon Hong, Jaesung Ahn, Junmo Kim

CoRR, July, 2025

Controllable Feature Whitening for Hyperparameter-Free Bias Mitigation.

Yooshin Cho, Hanbyel Cho, Janghyeon Lee, Hyeong Gwon Hong, Jaesung Ahn, Junmo Kim

Proceedings of the IEEE/CVF International Conference on Computer Vision, 2025

2024

Foreseeing Reconstruction Quality of Gradient Inversion: An Optimization Perspective.

Hyeong Gwon Hong, Yooshin Cho, Hanbyel Cho, Jaesung Ahn, Junmo Kim

Proceedings of the Thirty-Eighth AAAI Conference on Artificial Intelligence, 2024

2023

Localization using Multi-Focal Spatial Attention for Masked Face Recognition.

Yooshin Cho, Hanbyel Cho, Hyeong Gwon Hong, Jaesung Ahn, Dongmin Cho, JungWoo Chang, Junmo Kim

Proceedings of the 17th IEEE International Conference on Automatic Face and Gesture Recognition, 2023

Video Inference for Human Mesh Recovery with Vision Transformer.

Hanbyel Cho, Jaesung Ahn, Yooshin Cho, Junmo Kim

Proceedings of the 17th IEEE International Conference on Automatic Face and Gesture Recognition, 2023

Implicit 3D Human Mesh Recovery using Consistency with Pose and Shape from Unseen-view.

Hanbyel Cho, Yooshin Cho, Jaesung Ahn, Junmo Kim

Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern Recognition, 2023

2022

Rethinking Efficacy of Softmax for Lightweight Non-local Neural Networks.

Yooshin Cho, Youngsoo Kim, Hanbyel Cho, Jaesung Ahn, Hyeong Gwon Hong, Junmo Kim

Proceedings of the 2022 IEEE International Conference on Image Processing, 2022

2010

8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology.

Uksong Kang, Hoeju Chung, Seongmoo Heo, Dukha Park, Hoon Lee, Jin Ho Kim, Soon-Hong Ahn, Sooho Cha, Jaesung Ahn, Dukmin Kwon, Jae-Wook Lee, Han-Sung Joo, Woo-Seop Kim, Dong Hyeon Jang, Nam-Seog Kim, Jung-Hwan Choi, Tae-Gyeong Chung, Jei-Hwan Yoo, Joo-Sun Choi, Changhyun Kim, Young-Hyun Jun

IEEE J. Solid State Circuits, 2010

2009

8Gb 3D DDR3 DRAM using through-silicon-via technology.

Uksong Kang, Hoeju Chung, Seongmoo Heo, Soon-Hong Ahn, Hoon Lee, Sooho Cha, Jaesung Ahn, Dukmin Kwon, Jin Ho Kim, Jae-Wook Lee, Han-Sung Joo, Woo-Seop Kim, Hyun-Kyung Kim, Eun-Mi Lee, So-Ra Kim, Keum-Hee Ma, Dong-Hyun Jang, Nam-Seog Kim, Man-Sik Choi, Sae-Jang Oh, Jung-Bae Lee, Tae-Kyung Jung, Jei-Hwan Yoo, Changhyun Kim

Proceedings of the IEEE International Solid-State Circuits Conference, 2009