Kenneth P. Rodbell

According to our database, Kenneth P. Rodbell authored at least 7 papers between 1995 and 2015.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2015

SOI FinFET soft error upset susceptibility and analysis.

Phil Oldiges, Kenneth P. Rodbell, Michael S. Gordon, John G. Massey, Kevin Stawiasz, Conal E. Murray, Henry H. K. Tang, K. Kim, K. Paul Muller

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014

The resilience wall: Cross-layer solution strategies.

Subhasish Mitra, Pradip Bose, Eric Cheng, Chen-Yong Cher, Hyungmin Cho, Rajiv V. Joshi, Young Moon Kim, Charles R. Lefurgy, Yanjing Li, Kenneth P. Rodbell, Kevin Skadron, James H. Stathis, Lukasz G. Szafaryn

Proceedings of the Technical Papers of 2014 International Symposium on VLSI Design, 2014

2008

New simulation methodology for effects of radiation in semiconductor chip structures.

Henry H. K. Tang, Conal E. Murray, Giovanni Fiorenza, Kenneth P. Rodbell, Michael S. Gordon, David F. Heidel

IBM J. Res. Dev., 2008

Alpha-particle-induced upsets in advanced CMOS circuits and technology.

David F. Heidel, Kenneth P. Rodbell, Ethan H. Cannon, Cyril Cabral Jr., Michael S. Gordon, Phil Oldiges, Henry H. K. Tang

IBM J. Res. Dev., 2008

Preface.

David F. Heidel, Jack Hergenrother, Kenneth P. Rodbell

IBM J. Res. Dev., 2008

Single-event-upset and alpha-particle emission rate measurement techniques.

Michael S. Gordon, Kenneth P. Rodbell, David F. Heidel, Cyril Cabral Jr., Ethan H. Cannon, Daniel D. Reinhardt

IBM J. Res. Dev., 2008

1995

Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines.

Chao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin

IBM J. Res. Dev., 1995