Kohei Wakahara

According to our database, Kohei Wakahara authored at least 5 papers between 2013 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

A 3nm, 400TOPS, 1080k DMIPS SoC with Chiplet Support for ASIL D Automotive Cross-Domain Applications.

Shiro Machida, Kazuki Fukuoka, Tomoya Onda, Nobuhiro Yada, Hiroyuki Nakano, Sho Yamanaka, Hung Van Cao, Yusaku Hara, Takahiro Irita, Kohei Wakahara, Cyril Cordoba, Tatsuya Kamei, Yasuhisa Shimazaki

Proceedings of the IEEE International Solid-State Circuits Conference, 2026

2015

A 28 nm High-k/MG Heterogeneous Multi-Core Mobile Application Processor With 2 GHz Cores and Low-Power 1 GHz Cores.

Mitsuhiko Igarashi, Toshifumi Uemura, Ryo Mori, Hiroshi Kishibe, Midori Nagayama, Masaaki Taniguchi, Kohei Wakahara, Toshiharu Saito, Masaki Fujigaya, Kazuki Fukuoka, Koji Nii, Takeshi Kataoka, Toshihiro Hattori

IEEE J. Solid State Circuits, 2015

2014

10.2 A 28nm HPM heterogeneous multi-core mobile application processor with 2GHz cores and low-power 1GHz cores.

Mitsuhiko Igarashi, Toshifumi Uemura, Ryo Mori, Noriaki Maeda, Hiroshi Kishibe, Midori Nagayama, Masaaki Taniguchi, Kohei Wakahara, Toshiharu Saito, Masaki Fujigaya, Kazuki Fukuoka, Koji Nii, Takeshi Kataoka, Toshihiro Hattori

Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014

2013

Power-Management Features of R-Mobile U2, an Integrated Application Processor and Baseband Processor.

Kazuki Fukuoka, Noriaki Maeda, Koji Nii, Masaki Fujigaya, Noriaki Sakamoto, Takao Koike, Takahiro Irita, Kohei Wakahara, Tsugio Matsuyama, Keiji Hasegawa, Toshiharu Saito, Akira Fukuda, Kaname Teranishi, Takeshi Kataoka, Toshihiro Hattori

IEEE Micro, 2013

A 28nm High-κ metal-gate single-chip communications processor with 1.5GHz dual-core application processor and LTE/HSPA+-capable baseband processor.

Masaki Fujigaya, Noriaki Sakamoto, Takao Koike, Takahiro Irita, Kohei Wakahara, Tsugio Matsuyama, Keiji Hasegawa, Toshiharu Saito, Akira Fukuda, Kaname Teranishi, Kazuki Fukuoka, Noriaki Maeda, Koji Nii, Takeshi Kataoka, Toshihiro Hattori

Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013