Laurent Bally

According to our database1, Laurent Bally authored at least 3 papers between 1977 and 2009.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

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PhD thesis 
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Links

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Bibliography

2009
First integration of Cu TSV using die-to-wafer direct bonding and planarization.
Proceedings of the IEEE International Conference on 3D System Integration, 2009

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.
Proceedings of the IEEE International Conference on 3D System Integration, 2009

1977
A prototype approach to information system design and development.
Inf. Manag., 1977


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