Sophie Verrun

According to our database, Sophie Verrun authored at least 3 papers in 2009.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2009

First integration of Cu TSV using die-to-wafer direct bonding and planarization.

Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2009

3D integration technology for set-top box application.

David Henry, Séverine Cheramy, Jean Charbonnier, Pascal Chausse, Muriel Neyret, Cathy Brunet-Manquat, Sophie Verrun, Nicolas Sillon, Laurent Bonnot, Xavier Gagnard, E. Saugier

Proceedings of the IEEE International Conference on 3D System Integration, 2009

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier

Proceedings of the IEEE International Conference on 3D System Integration, 2009