Rachid Taibi

According to our database1, Rachid Taibi authored at least 3 papers between 2009 and 2012.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2012
Low temperature direct bonding: An attractive technique for heterostructures build-up.
Microelectron. Reliab., 2012

2011
200°C direct bonding copper interconnects : Electrical results and reliability.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.
Proceedings of the IEEE International Conference on 3D System Integration, 2009


  Loading...