Mingyen Lee

Orcid: 0000-0002-5076-4645

According to our database1, Mingyen Lee authored at least 16 papers between 2020 and 2025.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2025
DCiROM: A Fully Digital Compute-in-ROM Design Approach to High Energy Efficiency of DNN Inference at Task Level.
Proceedings of the 30th Asia and South Pacific Design Automation Conference, 2025

2024
Cramming More Weight Data Onto Compute-in-Memory Macros for High Task-Level Energy Efficiency Using Custom ROM With 3984-kb/mm<sup>2</sup> Density in 65-nm CMOS.
IEEE J. Solid State Circuits, June, 2024

GRAPHIC: Gather and Process Harmoniously in the Cache With High Parallelism and Flexibility.
IEEE Trans. Emerg. Top. Comput., 2024

A 28nm 8928Kb/mm<sup>2</sup>-Weight-Density Hybrid SRAM/ROM Compute-in-Memory Architecture Reducing >95% Weight Loading from DRAM.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2024

A 28nm 166.9 TOPS/W x Mb/mm<sup>2</sup> DRAM-Free QLC Compute-in-ROM Macro Supporting High Task-Level Inference Energy Efficiency for Tiny AI Edge Devices.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2024

ZEBRA: A Zero-Bit Robust-Accumulation Compute-In-Memory Approach for Neural Network Acceleration Utilizing Different Bitwise Patterns.
Proceedings of the 29th Asia and South Pacific Design Automation Conference, 2024

2023
SAMBA: Single-ADC Multi-Bit Accumulation Compute-in-Memory Using Nonlinearity- Compensated Fully Parallel Analog Adder Tree.
IEEE Trans. Circuits Syst. I Regul. Pap., July, 2023

FAST: A Fully-Concurrent Access SRAM Topology for High Row-Wise Parallelism Applications Based on Dynamic Shift Operations.
IEEE Trans. Circuits Syst. II Express Briefs, April, 2023

FeFET-Based Logic-in-Memory Supporting SA-Free Write-Back and Fully Dynamic Access With Reduced Bitline Charging Activity and Recycled Bitline Charge.
IEEE Trans. Circuits Syst. I Regul. Pap., 2023

Victor: A Variation-resilient Approach Using Cell-Clustered Charge-domain computing for High-density High-throughput MLC CiM.
Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023

2022
A 65nm 8b-Activation 8b-Weight SRAM-Based Charge-Domain Computing-in-Memory Macro Using A Fully-Parallel Analog Adder Network and A Single-ADC Interface.
CoRR, 2022

GRAPHIC: GatheR-And-Process in Highly parallel with In-SSD Compression Architecture in Very Large-Scale Graph.
CoRR, 2022

FAST: A Fully-Concurrent Access Technique to All SRAM Rows for Enhanced Speed and Energy Efficiency in Data-Intensive Applications.
CoRR, 2022

Hidden-ROM: A Compute-in-ROM Architecture to Deploy Large-Scale Neural Networks on Chip with Flexible and Scalable Post-Fabrication Task Transfer Capability.
Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, 2022

YOLoC: deploy large-scale neural network by ROM-based computing-in-memory using residual branch on a chip.
Proceedings of the DAC '22: 59th ACM/IEEE Design Automation Conference, San Francisco, California, USA, July 10, 2022

2020
FeFET-based low-power bitwise logic-in-memory with direct write-back and data-adaptive dynamic sensing interface.
Proceedings of the ISLPED '20: ACM/IEEE International Symposium on Low Power Electronics and Design, 2020


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