Olivier Valorge

According to our database, Olivier Valorge authored at least 14 papers between 2006 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Hybrid Integration of 3D-RF Interconnects on AlGaN/GaN/Si HEMT RF Transistor featuring 2.2W/mm Psat & 41% PAE @28GHz using a Robust and Cost-Effective Chiplet Heterogeneous Bonding Technique.

A. Divay, Olivier Valorge, Christophe Dubarry, M. Medbouhi, Rémi Franiatte, Daniel Mermin, R. Velard, Y. Gobil, F. Morisot, Erwan Morvan, Ismael Charlet, Luca Lucci, J. Lugo, Xavier Garros

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies.

Mohammad Alsukour, Olivier Valorge, Margot Faure, Loïc Vincent, Victor Milon, Pascal Chevalier, Emmanuel Pistono, Jean-Daniel Arnould, Christophe Dubarry

Proceedings of the International 3D Systems Integration Conference, 2024

2016

A novel spatially configurable differential interface for an electronic system prototyping platform.

Wasim Hussain, Olivier Valorge, Yves Blaquière, Yvon Savaria

Integr., 2016

2015

An efficient and simple compact modeling approach for 3-D interconnects with IC's stack global electrical context consideration.

Jean-Etienne Lorival, Françis Calmon, Fengyuan Sun, Felipe Frantz, Carole Plossu, Martine Le Berre, Ian O'Connor, Olivier Valorge, Jean Charbonnier, David Henry, Christian Gontrand

Microelectron. J., 2015

Corrigendum to "Modelling of through silicon via and devices electromagnetic coupling" [Microelectron. J 42 (2011) 316-324].

Mohamed Abouelatta-Ebrahim, Rabah Dahmani, Olivier Valorge, Françis Calmon, Christian Gontrand

Microelectron. J., 2015

2014

Experimental and simulation results on Si integrated inductor efficiency for smart RF-ICs.

A. S. Royet, J. C. Barbe, Olivier Valorge, L. Remy, I. Constant

Proceedings of the 21st IEEE International Conference on Electronics, Circuits and Systems, 2014

2013

Configurable Input-Output Power Pad for Wafer-Scale Microelectronic Systems.

Nicolas Laflamme-Mayer, Walder Andre, Olivier Valorge, Yves Blaquière, Mohamad Sawan

IEEE Trans. Very Large Scale Integr. Syst., 2013

2011

Modelling of through silicon via and devices electromagnetic coupling.

Mohamed Abouelatta-Ebrahim, Rabah Dahmani, Olivier Valorge, Françis Calmon, Christian Gontrand

Microelectron. J., 2011

2010

A spatially reconfigurable fast differential interface for a wafer scale configurable platform.

Olivier Valorge, Yves Blaquière, Yvon Savaria

Proceedings of the 17th IEEE International Conference on Electronics, 2010

2008

Digital signal propagation on a wafer-scale smart active programmable interconnect.

Olivier Valorge, Anh Tuan Nguyen, Yves Blaquière, Richard Norman, Yvon Savaria

Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems, 2008

2007

Electromagnetic Compatibility Modeling in Low-Noise Medical Sensor Interfaces.

Olivier Valorge, Benoit Gosselin, Louis-François Tanguay, Mohamad Sawan

Proceedings of the International Symposium on Circuits and Systems (ISCAS 2007), 2007

Signal Integrity Analysis of a High Precision D/A Converter.

Olivier Valorge, David Marche, Alain Lacourse, Mohamad Sawan, Yvon Savaria

Proceedings of the 14th IEEE International Conference on Electronics, 2007

2006

A Simple Way for Substrate Noise Modeling in Mixed-Signal ICs.

Olivier Valorge, Cristian Andrei, Françis Calmon, Jacques Verdier, Christian Gontrand, Pierre Dautriche

IEEE Trans. Circuits Syst. I Regul. Pap., 2006

Impact of low-frequency substrate disturbances on a 4.5GHz VCO.

Françis Calmon, Cristian Andrei, Olivier Valorge, José-Cruz Nuñez Pérez, Jacques Verdier, Christian Gontrand

Microelectron. J., 2006