Baozhen Li

According to our database, Baozhen Li authored at least 15 papers between 2002 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2022

Quantum Mechanical Connection of Schottky Emission Process and Its implications on Breakdown Methodology and Conduction Modeling for BEOL Low-k Dielectrics.

Ernest Y. Wu, Baozhen Li

Proceedings of the IEEE International Reliability Physics Symposium, 2022

A Flexible and Inherently Self-Consistent Methodology for MOL/BEOL/MIMCAP TDDB Applications with Excessive Variability-Induced Degradation.

Ernest Y. Wu, Ron Bolam, Baozhen Li, Tian Shen, Barry P. Linder, Griselda Bonilla, Miaomiao Wang, Dechao Guo

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2019

Comprehensive Methodology for Multiple Spots Competing Progressive Breakdown for BEOL/FEOL Applications.

Ernest Y. Wu, Baozhen Li, James H. Stathis, Andrew Kim

Proceedings of the IEEE International Reliability Physics Symposium, 2019

Transformation of Ramped Current Stress VBDto Constant Voltage Stress TDDB TBD.

Andrew Kim, Ernest Y. Wu, Baozhen Li, Barry P. Linder

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018

Elapsed-time statistics of successive breakdown in the presence of variability for dielectric breakdown in BEOL/MOL/FEOL applications.

Ernest Y. Wu, Andrew Kim, Baozhen Li, James H. Stathis

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Electromigration characteristics of power grid like structures.

Baozhen Li, Andrew Kim, Paul McLaughlin, Barry P. Linder, Cathryn Christiansen

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Transient self-heating modeling and simulations of back-end-of-line interconnects.

Andrew Kim, Baozhen Li, Barry P. Linder

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015

A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL).

Ernest Y. Wu, James H. Stathis, Baozhen Li, Barry P. Linder, Kai Zhao, Griselda Bonilla

Proceedings of the IEEE International Reliability Physics Symposium, 2015

A case study of electromigration reliability: From design point to system operations.

Baozhen Li, K. Paul Muller, James D. Warnock, Leon J. Sigal, Dinesh Badami

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014

Electromigration challenges for advanced on-chip Cu interconnects.

Baozhen Li, Cathryn Christiansen, Dinesh Badami, Chih-Chao Yang

Microelectron. Reliab., 2014

2008

Neural Network Approach Based on Agent to Predict Stock Performance.

Shengnan Xu, Baozhen Li, Yanhua Shao

Proceedings of the International Conference on Computer Science and Software Engineering, 2008

2006

Application of three-parameter lognormal distribution in EM data analysis.

Baozhen Li, Emmanuel Yashchin, Cathryn Christiansen, Jason Gill, Ronald Filippi, Timothy D. Sullivan

Microelectron. Reliab., 2006

2004

Reliability challenges for copper interconnects.

Baozhen Li, Timothy D. Sullivan, Tom C. Lee, Dinesh Badami

Microelectron. Reliab., 2004

Transformation & Countermeasures on Business Operation Models in Uncertain Environment.

Baozhen Li, Nana Li, Xianfeng Liu

Proceedings of the Fourth International Conference on Electronic Business, 2004

2002

A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO₂ and nitride-oxide dielectrics.

Fen Chen, Rolf-Peter Vollertsen, Baozhen Li, Dave Harmon, Wing L. Lai

Microelectron. Reliab., 2002