Bowen Liu

According to our database, Bowen Liu authored at least 14 papers between 2020 and 2025.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2025

H-PCC: Point Cloud Compression With Hybrid Mode Selection and Content Adaptive Down-Sampling.

Bowen Liu, Yu Chen, Boyang Wang, Mingyu Yang, Hun-Seok Kim

IEEE Robotics Autom. Lett., April, 2025

2024

AIMMI: Audio and Image Multi-Modal Intelligence via a Low-Power SoC With 2-MByte On-Chip MRAM for IoT Devices.

Zichen Fan, Qirui Zhang, Hyochan An, Boxun Xu, Li Xu, Chien-Wei Tseng, Yimai Peng, Andrea Bejarano-Carbo, Pierre Abillama, Ang Cao, Bowen Liu, Changwoo Lee, Zhehong Wang, Hun-Seok Kim, David T. Blaauw, Dennis Sylvester

IEEE J. Solid State Circuits, October, 2024

Diffusion-Aided Joint Source Channel Coding For High Realism Wireless Image Transmission.

Mingyu Yang, Bowen Liu, Boyang Wang, Hun-Seok Kim

CoRR, 2024

VCISR: Blind Single Image Super-Resolution with Video Compression Synthetic Data.

Boyang Wang, Bowen Liu, Shiyu Liu, Fengyu Yang

Proceedings of the IEEE/CVF Winter Conference on Applications of Computer Vision, 2024

2023

MMVC: Learned Multi-Mode Video Compression with Block-based Prediction Mode Selection and Density-Adaptive Entropy Coding.

Bowen Liu, Yu Chen, Rakesh Chowdary Machineni, Shiyu Liu, Hun-Seok Kim

Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern Recognition, 2023

2022

Audio and Image Cross-Modal Intelligence via a 10TOPS/W 22nm SoC with Back-Propagation and Dynamic Power Gating.

Zichen Fan, Hyochan An, Qirui Zhang, Boxun Xu, Li Xu, Chien-Wei Tseng, Yimai Peng, Ang Cao, Bowen Liu, Changwoo Lee, Zhehong Wang, Fanghao Liu, Guanru Wang, Shenghao Jiang, Hun-Seok Kim, David T. Blaauw, Dennis Sylvester

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

An End-to-End Deep Learning Framework For Multiple Audio Source Separation And Localization.

Yu Chen, Bowen Liu, Zijian Zhang, Hun-Seok Kim

Proceedings of the IEEE International Conference on Acoustics, 2022

2021

RRAM-DNN: An RRAM and Model-Compression Empowered All-Weights-On-Chip DNN Accelerator.

Ziyun Li, Zhehong Wang, Li Xu, Qing Dong, Bowen Liu, Chin-I Su, Wen-Ting Chu, George Tsou, Yu-Der Chih, Tsung-Yung Jonathan Chang, Dennis Sylvester, Hun-Seok Kim, David T. Blaauw

IEEE J. Solid State Circuits, 2021

An Ultra-Low-Power Image Signal Processor for Hierarchical Image Recognition With Deep Neural Networks.

Hyochan An, Sam Schiferl, Siddharth Venkatesan, Tim Wesley, Qirui Zhang, Jingcheng Wang, Kyojin Choo, Shiyu Liu, Bowen Liu, Ziyun Li, Luyao Gong, Hengfei Zhong, David T. Blaauw, Ronald G. Dreslinski, Hun-Seok Kim, Dennis Sylvester

IEEE J. Solid State Circuits, 2021

HTNN: Deep Learning in Heterogeneous Transform Domains with Sparse-Orthogonal Weights.

Yu Chen, Bowen Liu, Pierre Abillama, Hun-Seok Kim

Proceedings of the IEEE/ACM International Symposium on Low Power Electronics and Design, 2021

Deep Learning in Latent Space for Video Prediction and Compression.

Bowen Liu, Yu Chen, Shiyu Liu, Hun-Seok Kim

Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition, 2021

2020

A 170μW Image Signal Processor Enabling Hierarchical Image Recognition for Intelligence at the Edge.

Hyochan An, Siddharth Venkatesan, Sam Schiferl, Tim Wesley, Qirui Zhang, Jingcheng Wang, Kyojin Choo, Shiyu Liu, Bowen Liu, Ziyun Li, Hengfei Zhong, Luyao Gong, David T. Blaauw, Ronald G. Dreslinski, Dennis Sylvester, Hun-Seok Kim

Proceedings of the IEEE Symposium on VLSI Circuits, 2020

AA-ResNet: Energy Efficient All-Analog ResNet Accelerator.

Jongyup Lim, Myungjoon Choi, Bowen Liu, Taewook Kang, Ziyun Li, Zhehong Wang, Yiqun Zhang, Kaiyuan Yang, David T. Blaauw, Hun-Seok Kim, Dennis Sylvester

Proceedings of the 63rd IEEE International Midwest Symposium on Circuits and Systems, 2020

Unified Signal Compression Using Generative Adversarial Networks.

Bowen Liu, Ang Cao, Hun-Seok Kim

Proceedings of the 2020 IEEE International Conference on Acoustics, 2020