Jai-Ming Lin
Orcid: 0000-0001-8637-2144
According to our database1,
Jai-Ming Lin
authored at least 56 papers
between 1998 and 2024.
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Bibliography
2024
Proceedings of the 2024 International Symposium on Physical Design, 2024
2023
Multilevel Fixed-Outline Component Placement and Graph-Based Ball Assignment for System in Package.
IEEE Trans. Very Large Scale Integr. Syst., September, 2023
Voltage-Drop Optimization Through Insertion of Extra Stripes to a Power Delivery Network.
Proceedings of the 2023 International Symposium on Physical Design, 2023
Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023
HyPlace-3D: A Hybrid Placement Approach for 3D ICs Using Space Transformation Technique.
Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023
2022
PPOM: An Effective Post-Global Placement Optimization Methodology for Better Wirelength and Routability.
IEEE Trans. Very Large Scale Integr. Syst., 2022
Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, 2022
Routability-Driven Analytical Placement with Precise Penalty Models for Large-Scale 3D ICs.
Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, 2022
2021
Dataflow-Aware Macro Placement Based on Simulated Evolution Algorithm for Mixed-Size Designs.
IEEE Trans. Very Large Scale Integr. Syst., 2021
Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC.
IEEE Trans. Very Large Scale Integr. Syst., 2021
Thermal-Aware Fixed-Outline Floorplanning Using Analytical Models With Thermal-Force Modulation.
IEEE Trans. Very Large Scale Integr. Syst., 2021
Proceedings of the ISPD '21: International Symposium on Physical Design, 2021
Routability-driven Global Placer Target on Removing Global and Local Congestion for VLSI Designs.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2021
DAPA: A Dataflow-Aware Analytical Placement Algorithm for Modern Mixed-Size Circuit Designs.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2021
2019
Regularity-Aware Routability-Driven Macro Placement Methodology for Mixed-Size Circuits With Obstacles.
IEEE Trans. Very Large Scale Integr. Syst., 2019
Proceedings of the International Conference on Computer-Aided Design, 2019
Routability-driven Mixed-size Placement Prototyping Approach Considering Design Hierarchy and Indirect Connectivity Between Macros.
Proceedings of the 56th Annual Design Automation Conference 2019, 2019
2018
Proceedings of the International Conference on Computer-Aided Design, 2018
A fast thermal-aware fixed-outline floorplanning methodology based on analytical models.
Proceedings of the International Conference on Computer-Aided Design, 2018
Co-synthesis of floorplanning and powerplanning in 3D ICs for multiple supply voltage designs.
Proceedings of the 2018 Design, Automation & Test in Europe Conference & Exhibition, 2018
Proceedings of the 2018 Design, Automation & Test in Europe Conference & Exhibition, 2018
2017
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017
Regularity-aware routability-driven placement prototyping algorithm for hierarchical mixed-size circuits.
Proceedings of the 22nd Asia and South Pacific Design Automation Conference, 2017
2016
IEEE Trans. Very Large Scale Integr. Syst., 2016
An Efficient and Effective Methodology to Control Turn-On Sequence of Power Switches for Power Gating Designs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016
Proceedings of the 35th International Conference on Computer-Aided Design, 2016
A testable and debuggable dual-core system with thermal-aware dynamic voltage and frequency scaling.
Proceedings of the 21st Asia and South Pacific Design Automation Conference, 2016
2015
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2015
Routability-driven floorplanning algorithm for mixed-size modules with fixed-outline constraint.
Proceedings of the VLSI Design, Automation and Test, 2015
2014
F-FM: Fixed-Outline Floorplanning Methodology for Mixed-Size Modules Considering Voltage-Island Constraint.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014
Proceedings of the International Symposium on Physical Design, 2014
2013
IEEE Trans. Very Large Scale Integr. Syst., 2013
2012
IEEE Trans. Very Large Scale Integr. Syst., 2012
Mismatch-Aware Common-Centroid Placement for Arbitrary-Ratio Capacitor Arrays Considering Dummy Capacitors.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012
Proceedings of the International Symposium on Physical Design, 2012
Analytical-based approach for capacitor placement with gradient error compensation and device correlation enhancement in analog integrated circuits.
Proceedings of the 2012 IEEE/ACM International Conference on Computer-Aided Design, 2012
Proceedings of the 17th Asia and South Pacific Design Automation Conference, 2012
2011
UFO: Unified Convex Optimization Algorithms for Fixed-Outline Floorplanning Considering Pre-Placed Modules.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2011
Common-centroid capacitor placement considering systematic and random mismatches in analog integrated circuits.
Proceedings of the 48th Design Automation Conference, 2011
Efficient multi-layer obstacle-avoiding preferred direction rectilinear Steiner tree construction.
Proceedings of the 16th Asia South Pacific Design Automation Conference, 2011
2010
Proceedings of the 47th Design Automation Conference, 2010
Proceedings of the 15th Asia South Pacific Design Automation Conference, 2010
2005
IEEE Trans. Very Large Scale Integr. Syst., 2005
Proceedings of the 2005 Conference on Asia South Pacific Design Automation, 2005
2004
TCG-S: orthogonal coupling of P<sup>*</sup>-admissible representations for general floorplans.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2004
2003
Corner sequence - a P-admissible floorplan representation with a worst case linear-time packing scheme.
IEEE Trans. Very Large Scale Integr. Syst., 2003
Graph matching-based algorithms for array-based FPGA segmentation design and routing.
Proceedings of the 2003 Asia and South Pacific Design Automation Conference, 2003
2002
Arbitrarily shaped rectilinear module placement using the transitive closure graph representation.
IEEE Trans. Very Large Scale Integr. Syst., 2002
ACM Trans. Design Autom. Electr. Syst., 2002
Proceedings of the 2002 Design, 2002
2001
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2001
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2001
Proceedings of the 19th International Conference on Computer Design (ICCD 2001), 2001
Proceedings of the 19th International Conference on Computer Design (ICCD 2001), 2001
Proceedings of the 38th Design Automation Conference, 2001
1998
Proceedings of the 1998 IEEE/ACM International Conference on Computer-Aided Design, 1998