Jeongyeol Bae

According to our database1, Jeongyeol Bae authored at least 8 papers between 2019 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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PhD thesis 
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Links

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Bibliography

2024
4.2 A Tri-Band Dual-Concurrent Wi-Fi 802.11be Transceiver Achieving -46dB TX/RX EVM Floor at 7.1GHz for a 4K-QAM 320MHz Signal.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024

4.3 A 43mm<sup>2</sup> Fully Integrated Legacy Cellular and 5G FR1 RF Transceiver with 24RX/3TX Supporting Inter-Band 7CA/5CA 4×4 MIMO with 1K-QAM.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024

2022
A Single Path Digital-IF Receiver Supporting Inter/Intra 5-CA With a Single Integer LO-PLL in 14-nm CMOS FinFET.
IEEE J. Solid State Circuits, 2022

A Single-Path Digital-IF Receiver Supporting Inter/Intra 5-CA with a Single Integer LO-PLL in 14nm CMOS FinFET.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2021
6.1 A Low-Power and Low-Cost 14nm FinFET RFIC Supporting Legacy Cellular and 5G FR1.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021

2020
An RF Transceiver with Full Digital Interface Supporting 5G New Radio FR1 with 3.84Gbps DL/1.92Gbps UL and Dual-Band GNSS in 14nm FinFET CMOS.
Proceedings of the IEEE Symposium on VLSI Circuits, 2020

2019
A Sub-6-GHz 5G New Radio RF Transceiver Supporting EN-DC With 3.15-Gb/s DL and 1.27-Gb/s UL in 14-nm FinFET CMOS.
IEEE J. Solid State Circuits, 2019

A Sub-6GHz 5G New Radio RF Transceiver Supporting EN-DC with 3.15Gb/s DL and 1.27Gb/s UL in 14nm FinFET CMOS.
Proceedings of the IEEE International Solid- State Circuits Conference, 2019


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