Huijung Kim

According to our database, Huijung Kim authored at least 8 papers between 2010 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

A Tri-Band Dual-Concurrent Wi-Fi 802.11be Transceiver Achieving -46 dB TX/RX EVM Floor at 7.1 GHz for a 4 K-QAM 320 MHz Signal.

Jongsoo Lee, Jaehyuk Jang, Wooseok Lee, Bosung Suh, Heeyong Yoo, Beomyu Park, Jeongkyun Woo, Inhyo Ryu, Honggul Han, Jaeyoung Kim, Hojung Kang, John H. Kang, Minseob Lee, Danbi Lee, Hyeonuk Son, Suhyeon Lee, Soyeon Kim, Dong-Chan Kim, Dae-Young Yoon, Hongjong Park, Sangsung Lee, Jeongyeol Bae, Huijung Kim, Joonhee Lee, Sangmin Yoo

IEEE J. Solid State Circuits, December, 2024

Cell to Core-Periphery Overlap (C2O) Based on BCAT for Next Generation DRAM.

Kiseok Lee, Hongjun Lee, Hyungeun Choi, Jeongsu Kim, Kyunghwan Kim, Moonyoung Jeong, Soohyun Bae, Hyebin Kim, Jiyun Lee, Minsoo Kim, Keunnam Kim, Huijung Kim, Sungmin Park, Taejin Park, Jin-Woo Han, Jeonghoon Oh, Yong Kwan Kim, Sungsoo Yim, Bongsoo Kim, Jemin Park, Jaihyuk Song

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

4.2 A Tri-Band Dual-Concurrent Wi-Fi 802.11be Transceiver Achieving -46dB TX/RX EVM Floor at 7.1GHz for a 4K-QAM 320MHz Signal.

Jongsoo Lee, Jaehyuk Jang, Wooseok Lee, Bosung Suh, Heeyong Yoo, Beomyu Park, Jeongkyun Woo, Jaeeun Jang, Inhyo Ryu, Honggul Han, Jaeyoung Kim, Byoungjoong Kang, Minchul Kang, Hojung Kang, John H. Kang, Minseob Lee, Danbi Lee, Hyeonuk Son, Suhyeon Lee, Soyeon Kim, Hongjong Park, Sangsung Lee, Jeongyeol Bae, Huijung Kim, Joonhee Lee, Sangmin Yoo

Proceedings of the IEEE International Solid-State Circuits Conference, 2024

2019

Estimating Power Consumption of Air-conditioners Using a Sequence-to-sequence Model.

Inhwan Hwang, Hyeonje Cho, Yunhu Ji, Huijung Kim

Proceedings of the 9th IEEE International Conference on Consumer Electronics, 2019

2015

9.5 efficient digital quadrature transmitter based on IQ cell sharing.

Hadong Jin, Dongsu Kim, Sangsu Jin, Hankyu Lee, Kyunghoon Moon, Huijung Kim, Bumman Kim

Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015

2012

Novel Deep Trench Buried-Body-Contact (DBBC) of 4F² cell for sub 30nm DRAM technology.

Youngseung Cho, Yoosang Hwang, Huijung Kim, Eunok Lee, Soojin Hong, Hyun-Woo Chung, Daeik Kim, Jinyoung Kim, Yong Chul Oh, Hyeongsun Hong, Gyo-Young Jin, Chilhee Chung

Proceedings of the 2012 European Solid-State Device Research Conference, 2012

2010

A 31 ns Random Cycle VCAT-Based 4F ² DRAM With Manufacturability and Enhanced Cell Efficiency.

Ki-Whan Song, Jinyoung Kim, Jae-Man Yoon, Sua Kim, Huijung Kim, Hyun-Woo Chung, Hyungi Kim, Kanguk Kim, Hwan-Wook Park, Hyun Chul Kang, Nam-Kyun Tak, Dukha Park, Woo-Seop Kim, Yeong-Taek Lee, Yong Chul Oh, Gyo-Young Jin, Jei-Hwan Yoo, Donggun Park, Kyungseok Oh, Changhyun Kim, Young-Hyun Jun

IEEE J. Solid State Circuits, 2010

A multistandard multiband mobile TV RF SoC in 65nm CMOS.

Jae-Hong Chang, Huijung Kim, Jeong-Hyun Choi, Hangun Chung, Jungwook Heo, Sanghoon Kang, Jong-Dae Bae, Heetae Oh, Youngwoon Kim, Taek-Won Kwon, Ryan Kim, Wooseung Choo, Dojun Rhee, Byeong-Ha Park

Proceedings of the IEEE International Solid-State Circuits Conference, 2010