Jungdon Ihm

According to our database, Jungdon Ihm authored at least 3 papers between 2020 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

A Single-Ended Offset-Compensating Bit-Line Sense-Amplifier with Ground Precharge and Charge Transfer Pre sensing for Sub-1V DRAM.

Changyoung Lee, Youngseok Park, Hyunchul Yoon, Seryeong Yoon, Donggeon Kim, Bokyeon Won, Junhwa Song, In-Jae Bae, Jaejoon Song, Kyuchang Kang, Jaehyuk Kim, Kyungrak Cho, Incheol Nam, Jungdon Ihm, Young-Hun Seo, Changsik Yoo, Sang Jun Hwang

Proceedings of the IEEE Asian Solid-State Circuits Conference, 2024

2021

A 1.8-Gb/s/Pin 16-Tb NAND Flash Memory Multi-Chip Package With F-Chip for High-Performance and High-Capacity Storage.

Dae-Hoon Na, Jang-Woo Lee, Seon-Kyoo Lee, Hwasuk Cho, Junha Lee, Manjae Yang, Eunjin Song, Anil Kavala, Tongsung Kim, Dong-Su Jang, Youngmin Jo, Ji-Yeon Shin, Byung-Kwan Chun, Tae-Sung Lee, Byunghoon Jeong, Chiweon Yoon, Dongku Kang, Seungjae Lee, Jungdon Ihm, Dae-Seok Byeon, Jinyub Lee, Jai Hyuk Song

IEEE J. Solid State Circuits, 2021

2020

A 1.8 Gb/s/pin 16Tb NAND Flash Memory Multi-Chip Package with F-Chip of Toggle 4.0 Specification for High Performance and High Capacity Storage Systems.

Jang-Woo Lee, Dae-Hoon Na, Anil Kavala, Hwasuk Cho, Junha Lee, Manjae Yang, Eunjin Song, Tongsung Kim, Seon-Kyoo Lee, Dong-Su Jang, Byung-Kwan Chun, Youngmin Jo, Sunwon Jung, Doo-Il Jung, Chan-ho Kim, Daewoon Kang, Tae-Sung Lee, Byunghoon Jeong, Chiweon Yoon, Dongku Kang, Seungjae Lee, Jungdon Ihm, Dae-Seok Byeon, Jin-Yup Lee, Sangjoon Hwang, Jai Hyuk Song

Proceedings of the IEEE Symposium on VLSI Circuits, 2020