Leif Paulson

According to our database, Leif Paulson authored at least 3 papers between 2018 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing.

Walid M. Hafez, P. Agnihotri, M. Asoro, M. Aykol, B. Bains, R. Bambery, M. Bapna, A. Barik, A. Chatterjee, P. C. Chiu, T. Chu, C. Firby, K. Fischer, M. Fradkin, Hannes Greve, A. Gupta, E. Haralson, M. Haran, Jeffery Hicks, A. Illa, M. Jang, S. Klopcic, M. Kobrinsky, B. Kuns, H.-h. Lai, G. Lanni, S.-H. Lee, N. Lindert, C.-l. Lo, Y. Luo, G. Malyavanatham, B. Marinkovic, Y. Maymon, M. Nabors, J. Neirynck, P. Packan, A. Paliwal, L. Pantisano, Leif Paulson, Padma Penmatsa, Chetan Prasad, Conor Puls, T. Rahman, R. Ramaswamy, S. Samant, Bernhard Sell, K. Sethi, F. Shah, M. Shamanna, K. Shang, Q. Li, M. Sibakoti, J. Stoeger, N. Strutt, R. Thirugnanasambandam, C. Tsai, X. Wang, A. Wang, S.-j. Wu, Q. Xu, X.-h. Zhong, S. Natarajan

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2020

Reliability Characterization for 12 V Application Using the 22FFL FinFET Technology.

Chen-Yi Su, Mark Armstrong, Sunny Chugh, Mohammed El-tanani, Hannes Greve, Hai Li, Mahjabin Maksud, Benjamin Orr, Christopher Perini, James Palmer, Leif Paulson, Stephen Ramey, James Waldemer, Yang Yang, Dave Young

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2018

Transistor reliability characterization and modeling of the 22FFL FinFET technology.

Chen-Yi Su, M. Armstrong, Lei Jiang, S. A. Kumar, C. D. Landon, S. Liu, Inanc Meric, K. W. Park, Leif Paulson, K. Phoa, Bernhard Sell, Jihan Standfest, Ketul B. Sutaria, J. Wan, D. Young, Stephen Ramey

Proceedings of the IEEE International Reliability Physics Symposium, 2018