L. Pantisano

According to our database, L. Pantisano authored at least 5 papers between 2018 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing.

Walid M. Hafez, P. Agnihotri, M. Asoro, M. Aykol, B. Bains, R. Bambery, M. Bapna, A. Barik, A. Chatterjee, P. C. Chiu, T. Chu, C. Firby, K. Fischer, M. Fradkin, Hannes Greve, A. Gupta, E. Haralson, M. Haran, Jeffery Hicks, A. Illa, M. Jang, S. Klopcic, M. Kobrinsky, B. Kuns, H.-h. Lai, G. Lanni, S.-H. Lee, N. Lindert, C.-l. Lo, Y. Luo, G. Malyavanatham, B. Marinkovic, Y. Maymon, M. Nabors, J. Neirynck, P. Packan, A. Paliwal, L. Pantisano, Leif Paulson, Padma Penmatsa, Chetan Prasad, Conor Puls, T. Rahman, R. Ramaswamy, S. Samant, Bernhard Sell, K. Sethi, F. Shah, M. Shamanna, K. Shang, Q. Li, M. Sibakoti, J. Stoeger, N. Strutt, R. Thirugnanasambandam, C. Tsai, X. Wang, A. Wang, S.-j. Wu, Q. Xu, X.-h. Zhong, S. Natarajan

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

A detailed comparison of various off-state breakdown methodologies for scaled Tri-gate technologies.

K. Joshi, D. Nminibapiel, M. Ghoneim, D. Ali, R. Ramamurthy, L. Pantisano, Inanc Meric, Stephen Ramey

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Method to evaluate off-state breakdown in scaled Tri-gate technologies.

D. Nminibapiel, K. Joshi, R. Ramamurthy, L. Pantisano, Inanc Meric, Stephen Ramey

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2020

Self-heating characterization and its applications in technology development.

Peter C. Paliwoda, Maria Toledano-Luque, Tanya Nigam, Fernando Guarin, M. Nour, S. Cimino, L. Pantisano, A. Gupta, Oscar Huerta-Gonzalez, M. Hauser, W. Liu, A. Vayshenker, D. Ioannou, D. Lee, L. Jiang, P. Yee, Stewart E. Rauch, B. Min

Proceedings of the 29th IEEE North Atlantic Test Workshop, 2020

2018

Understanding gate metal work function (mWF) impact on device reliability - A holistic approach.

P. Srinivasan, Rakesh Ranjan, S. Cimino, A. Zainuddin, B. Kannan, L. Pantisano, I. Mahmud, G. Dilliway, Tanya Nigam

Proceedings of the IEEE International Reliability Physics Symposium, 2018