P. Packan
According to our database1,
P. Packan
authored at least 3 papers
between 2015 and 2023.
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Bibliography
2023
Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
2022
Intel 4 CMOS Technology Featuring Advanced FinFET Transistors optimized for High Density and High-Performance Computing.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
2015
Proceedings of the IEEE International Reliability Physics Symposium, 2015