Melina Lofrano

According to our database, Melina Lofrano authored at least 9 papers between 2011 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).

Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, James Myers, Francky Catthoor, Julien Ryckaert

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Towards accurate temperature prediction in BEOL for reliability assessment (Invited).

Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.

Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Assessment of critical Co electromigration parameters.

O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, Emmanuel Chery, Ivan Ciofi, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021

Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.

Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tökei, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2018

Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly.

Melina Lofrano, Vladimir Cherman, Mario Gonzalez, Eric Beyne

Microelectron. Reliab., 2018

Stress mitigation of 3D-stacking/packaging induced stresses.

Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2014

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.

Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei

Microelectron. Reliab., 2014

2011

Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach.

Melina Lofrano, Kris Croes, Ingrid De Wolf, Christopher J. Wilson

Microelectron. Reliab., 2011