Zsolt Tokei

According to our database1, Zsolt Tokei authored at least 25 papers between 2005 and 2020.

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Bibliography

2020
Metal reliability mechanisms in Ruthenium interconnects.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019
Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018
Insights into metal drift induced failure in MOL and BEOL.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Stress mitigation of 3D-stacking/packaging induced stresses.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

The first observation of p-type electromigration failure in full ruthenium interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017
Statistical Timing Analysis Considering Device and Interconnect Variability for BEOL Requirements in the 5-nm Node and Beyond.
IEEE Trans. Very Large Scale Integr. Syst., 2017

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.
Microelectron. Reliab., 2017

2016
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.
Microelectron. Reliab., 2016

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.
Microelectron. Reliab., 2016

2015
Technology/circuit co-optimization and benchmarking for graphene interconnects at Sub-10nm technology node.
Proceedings of the Sixteenth International Symposium on Quality Electronic Design, 2015

Constant voltage electromigration for advanced BEOL copper interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Intrinsic reliability of local interconnects for N7 and beyond.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of process variability on BEOL TDDB lifetime model assessment.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of interconnect multiple-patterning variability on SRAMs.
Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, 2015

Holisitic device exploration for 7nm node.
Proceedings of the 2015 IEEE Custom Integrated Circuits Conference, 2015

2014
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.
Microelectron. Reliab., 2014

As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.
Microelectron. Reliab., 2014

Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies.
Proceedings of the 44th European Solid State Device Research Conference, 2014


2008
Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle.
Microelectron. Reliab., 2008

A tool flow for predicting system level timing failures due to interconnect reliability degradation.
Proceedings of the 18th ACM Great Lakes Symposium on VLSI 2008, 2008

2006
Reliability issues in deep deep sub-micron technologies: time-dependent variability and its impact on embedded system design.
Proceedings of the IFIP VLSI-SoC 2006, 2006

2005
Reliability challenges for copper low-k dielectrics and copper diffusion barriers.
Microelectron. Reliab., 2005

Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability.
Microelectron. Reliab., 2005


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