Vladimir Cherman

According to our database1, Vladimir Cherman authored at least 15 papers between 2010 and 2019.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2019
Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly.
Microelectron. Reliab., 2018

Stress mitigation of 3D-stacking/packaging induced stresses.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016
B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages.
Microelectron. Reliab., 2016

Reliability Challenges Related to TSV Integration and 3-D Stacking.
IEEE Des. Test, 2016

2015
Thermal experimental and modeling analysis of high power 3D packages.
Proceedings of the 2015 International Conference on IC Design & Technology, 2015

2014
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.
Microelectron. Reliab., 2014

Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2012
MEMS packaging and reliability: An undividable couple.
Microelectron. Reliab., 2012

Effect of the functionalization process on the performance of SiGe MEM resonators used for bio-molecular sensing.
Microelectron. Reliab., 2012

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011
Fine grain thermal modeling and experimental validation of 3D-ICs.
Microelectron. J., 2011

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
IEEE J. Solid State Circuits, 2011

Analysis of microbump induced stress effects in 3D stacked IC technologies.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010


  Loading...