Mu Nie

According to our database, Mu Nie authored at least 12 papers between 2017 and 2025.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2025

Segmentation-Enhanced Overlapped Defect Identification for Multipatterns Wafer Maps.

Tianming Ni, Wen Jiang, Huaguo Liang, Xiaoqing Wen, Mu Nie

IEEE Trans. Instrum. Meas., 2025

A lightweight general PUF framework for resisting machine learning attacks.

Tianming Ni, Fei Li, Zhengfeng Huang, Aibin Yan, Senling Wang, Xiaoqing Wen, Mu Nie, Jingchang Bian

Integr., 2025

Efficient Modulated State Space Model for Mixed-Type Wafer Defect Pattern Recognition.

Mu Nie, Shidong Zhu, Aibin Yan, Cheng Zhuo, Xiaoqing Wen, Tianming Ni

Proceedings of the Design, Automation & Test in Europe Conference, 2025

2024

A demultiplexer-based dual-path switching true random number generator.

Tianming Ni, Kejie Xu, Hao Wu, Senling Wang, Mu Nie

Microelectron. J., 2024

2023

Multi-receptive field spatiotemporal network for action recognition.

Mu Nie, Sen Yang, Zhenhua Wang, Baochang Zhang, Huimin Lu, Wankou Yang

Int. J. Mach. Learn. Cybern., July, 2023

Enhancing motion visual cues for self-supervised video representation learning.

Mu Nie, Zhibin Quan, Weiping Ding, Wankou Yang

Eng. Appl. Artif. Intell., 2023

Enhancing Defect Diagnosis and Localization in Wafer Map Testing Through Weakly Supervised Learning.

Mu Nie, Wen Jiang, Wankou Yang, Senling Wang, Xiaoqing Wen, Tianming Ni

Proceedings of the 32nd IEEE Asian Test Symposium, 2023

2022

Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement.

Tianming Ni, Jingchang Bian, Zhao Yang, Mu Nie, Liang Yao, Zhengfeng Huang, Aibin Yan, Xiaoqing Wen

IEEE Des. Test, 2022

2021

TransPose: Keypoint Localization via Transformer.

Sen Yang, Zhibin Quan, Mu Nie, Wankou Yang

Proceedings of the 2021 IEEE/CVF International Conference on Computer Vision, 2021

2020

TransPose: Towards Explainable Human Pose Estimation by Transformer.

Sen Yang, Zhibin Quan, Mu Nie, Wankou Yang

CoRR, 2020

2017

A Region-Based Through-Silicon via Repair Method for Clustered Faults.

Tianming Ni, Huaguo Liang, Mu Nie, Xiumin Xu, Aibin Yan, Zhengfeng Huang

IEICE Trans. Electron., 2017

Vernier ring based pre-bond through silicon vias test in 3D ICs.

Tianming Ni, Mu Nie, Huaguo Liang, Jingchang Bian, Xiumin Xu, Xiangsheng Fang, Zhengfeng Huang, Xiaoqing Wen

IEICE Electron. Express, 2017