Myat Thu Linn Aung

According to our database, Myat Thu Linn Aung authored at least 13 papers between 2011 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

DeepFire2: A Convolutional Spiking Neural Network Accelerator on FPGAs.

Myat Thu Linn Aung, Daniel Gerlinghoff, Chuping Qu, Liwei Yang, Tian Huang, Rick Siow Mong Goh, Tao Luo, Weng-Fai Wong

IEEE Trans. Computers, October, 2023

2022

Corrigendum to "Coreset: Hierarchical neuromorphic computing supporting large-scale neural networks with improved resource efficiency" [Neurocomputing (2022) 128-140].

Liwei Yang, Huaipeng Zhang, Tao Luo, Chuping Qu, Myat Thu Linn Aung, Yingnan Cui, Jun Zhou, Ming Ming Wong, Junran Pu, Anh Tuan Do, Rick Siow Mong Goh, Weng-Fai Wong

Neurocomputing, 2022

Coreset: Hierarchical neuromorphic computing supporting large-scale neural networks with improved resource efficiency.

Liwei Yang, Huaipeng Zhang, Tao Luo, Chuping Qu, Myat Thu Linn Aung, Yingnan Cui, Jun Zhou, Ming Ming Wong, Junran Pu, Anh Tuan Do, Rick Siow Mong Goh, Weng-Fai Wong

Neurocomputing, 2022

2021

DeepFire: Acceleration of Convolutional Spiking Neural Network on Modern Field Programmable Gate Arrays.

Myat Thu Linn Aung, Chuping Qu, Liwei Yang, Tao Luo, Rick Siow Mong Goh, Weng-Fai Wong

Proceedings of the 31st International Conference on Field-Programmable Logic and Applications, 2021

2018

Experimental Verification of a Simple, Intuitive, and Accurate Closed-Form Transfer Function Model for Diverse High-Speed Interconnects.

Kyunghyun Lim, Minsoo Choi, Myat Thu Linn Aung, Kyunghwan Kim, Ji-Seong Kim, Rock-Hyun Baek, Ho-Jin Song, Tony Tae-Hyoung Kim, Byungsub Kim

Proceedings of the International SoC Design Conference, 2018

2017

Yield Enhancement of Face-to-Face Cu-Cu Bonding With Dual-Mode Transceivers in 3DICs.

Myat Thu Linn Aung, Takefumi Yoshikawa, Chuan Seng Tan, Tony Tae-Hyoung Kim

IEEE Trans. Very Large Scale Integr. Syst., 2017

2016

2.31-Gb/s/ch Area-Efficient Crosstalk Canceled Hybrid Capacitive Coupling Interconnect for 3-D Integration.

Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim

IEEE Trans. Very Large Scale Integr. Syst., 2016

Self-contained built-in-self-test/repair transceivers for interconnects in 3DICs.

Myat Thu Linn Aung, Tony T. Kim

Proceedings of the 2016 IEEE Asia Pacific Conference on Circuits and Systems, 2016

2014

A 3-Gb/s/ch Simultaneous Bidirectional Capacitive Coupling Transceiver for 3DICs.

Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim

IEEE Trans. Circuits Syst. II Express Briefs, 2014

2013

Design of self-biased fully differential receiver and crosstalk cancellation for capacitive coupled vertical interconnects in 3DICs.

Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim

Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013

2012

Design of Simultaneous Bi-Directional Transceivers Utilizing Capacitive Coupling for 3DICs in Face-to-Face Configuration.

Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim

IEEE J. Emerg. Sel. Topics Circuits Syst., 2012

2011

Adaptive priority toggle asynchronous tree arbiter for AER-based image sensor.

Myat Thu Linn Aung, Anh-Tuan Do, Shoushun Chen, Kiat Seng Yeo

Proceedings of the IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, 2011

Design of capacitive-coupling-based simultaneously bi-directional transceivers for 3DIC.

Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011