Sameer Deshpande

According to our database, Sameer Deshpande authored at least 6 papers between 2014 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

A Roadmap and Case Study of Haptic-Enabled Tele-Ultrasound Systems: From Concept to Clinical Feasibility.

Zoran Najdovski, Mohammad Reza Chalak Qazani, Siamak Pedrammehr, Houshyar Asadi, Hamid Abdi, Van Thanh Huynh, Sameer Deshpande, Taoming Liu, James Mullins, Michael Fielding, Stephen John Hilton, Toshio Fukuda

IEEE Instrum. Meas. Mag., May, 2026

2024

HaptiScan: A Haptically-Enabled Robotic Ultrasound System for Remote Medical Diagnostics.

Zoran Najdovski, Siamak Pedrammehr, Mohammad Reza Chalak Qazani, Hamid Abdi, Sameer Deshpande, Taoming Liu, James Mullins, Michael Fielding, Stephen John Hilton, Houshyar Asadi

Robotics, 2024

Characterization and Multiscale Modeling of TDDB in State-of-the-art BEOL.

Andrea Palmieri, Mahdi Tavakoli, Chi Ching, Wenkai Zheng, Shi You, Xiaodong Zhang, Davide Cornigli, Michael Haverty, Navneet Singh, Luca Larcher, Monika Jamieson, Ajay Bhatnagar, Alexander Jansen, Max Gage, Jianshe Tang, Sameer Deshpande, Brian Brown, Arun Srivatsa, Mehul Naik, Bo Xie, Jerry Gelatos, Joung Joo Lee, Xianmin Tang, Gaurav Thareja, Milan Pesic

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023

BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond.

Gaurav Thareja, Ashish Pal, Xingye Wang, Sefa Dag, Shi You, Shashank Sharma, Qing Zhu, Carmen L. Cervantes, Shinjae Hwang, Matthew Spuller, Ben Ng, Pradeep S. Kumar, Norman Tam, Max Gage, Sameer Deshpande, Zhiyuan Wu, Alexander Jansen, Liton Dey, Feng Chen, Xianjin Xie, Keyvan Kashefizadeh, Vinod Reddy, Andy Lo, Zhebo Chen, Sidney Huey, Jianshe Tang, He Ren, Mehul Naik, Brian Brown, Sree Kesapragada, Buvna Ayyagari-Sangamalli, El Mehdi Bazizi, Xianmin Tang

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2017

Car park occupancy analysis using UAV images.

Hailing Zhou, Lei Wei, Michael Fielding, Douglas C. Creighton, Sameer Deshpande, Saeid Nahavandi

Proceedings of the 2017 IEEE International Conference on Systems, Man, and Cybernetics, 2017

2014

Extending support to customised multi-point haptic devices in CHAI3D.

Lei Wei, Zoran Najdovski, Hailing Zhou, Sameer Deshpande, Saeid Nahavandi

Proceedings of the 2014 IEEE International Conference on Systems, Man, and Cybernetics, 2014