Sandip Halder

Orcid: 0000-0002-6314-2685

According to our database1, Sandip Halder authored at least 17 papers between 2011 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2023
Applying Machine Learning Models on Metrology Data for Predicting Device Electrical Performance.
CoRR, 2023

Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy.
CoRR, 2023

Benchmarking Feature Extractors for Reinforcement Learning-Based Semiconductor Defect Localization.
CoRR, 2023

Deep learning denoiser assisted roughness measurements extraction from thin resists with low Signal-to-Noise Ratio(SNR) SEM images: analysis with SMILE.
CoRR, 2023

Automated Semiconductor Defect Inspection in Scanning Electron Microscope Images: a Systematic Review.
CoRR, 2023

SEMI-CenterNet: A Machine Learning Facilitated Approach for Semiconductor Defect Inspection.
CoRR, 2023

YOLOv8 for Defect Inspection of Hexagonal Directed Self-Assembly Patterns: A Data-Centric Approach.
CoRR, 2023

SEMI-DiffusionInst: A Diffusion Model Based Approach for Semiconductor Defect Classification and Segmentation.
CoRR, 2023

A Deep Learning Framework for Verilog Autocompletion Towards Design and Verification Automation.
CoRR, 2023

SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering.
CoRR, 2023

Optimizing YOLOv7 for Semiconductor Defect Detection.
CoRR, 2023

2022
Deep Learning based Defect classification and detection in SEM images: A Mask R-CNN approach.
CoRR, 2022

Deep Learning-Based Defect Classification and Detection in SEM Images.
CoRR, 2022

Code Generation Using Machine Learning: A Systematic Review.
IEEE Access, 2022

A Comparative Study of Deep-Learning Object Detectors for Semiconductor Defect Detection.
Proceedings of the 29th IEEE International Conference on Electronics, Circuits and Systems, 2022

2020
Using Unsupervised Machine Learning for Plasma Etching Endpoint Detection.
Proceedings of the 9th International Conference on Pattern Recognition Applications and Methods, 2020

2011
In-line metrology and inspection for process control during 3D stacking of IC's.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011


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