Sechang Oh

Orcid: 0000-0003-1520-8122

Affiliations:
  • Apple Inc., Cambridge, MA, USA
  • University of Michigan, Ann Arbor, MI, USA (PhD 2017)


According to our database1, Sechang Oh authored at least 21 papers between 2014 and 2022.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Online presence:

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Bibliography

2022
A Delta Sigma-Modulated Sample and Average Common-Mode Feedback Technique for Capacitively Coupled Amplifiers in a 192-nW Acoustic Analog Front-End.
IEEE J. Solid State Circuits, 2022

2020
Sample and Average Common-Mode Feedback in a 101 nW Acoustic Amplifier.
Proceedings of the IEEE Symposium on VLSI Circuits, 2020

26.9 A 0.19×0.17mm<sup>2</sup> Wireless Neural Recording IC for Motor Prediction with Near-Infrared-Based Power and Data Telemetry.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

2019
A 256 pixel, 21.6 μW infrared gesture recognition processor for smart devices.
Microelectron. J., 2019

An Efficient Piezoelectric Energy Harvesting Interface Circuit Using a Sense-and-Set Rectifier.
IEEE J. Solid State Circuits, 2019

An Acoustic Signal Processing Chip With 142-nW Voice Activity Detection Using Mixer-Based Sequential Frequency Scanning and Neural Network Classification.
IEEE J. Solid State Circuits, 2019

The Internet of Tiny Things: Recent Advances of Millimeter-Scale Computing.
IEEE Des. Test, 2019

A 1.74.12 mm<sup>3</sup> Fully Integrated pH Sensor for Implantable Applications using Differential Sensing and Drift-Compensation.
Proceedings of the 2019 Symposium on VLSI Circuits, Kyoto, Japan, June 9-14, 2019, 2019

An Adiabatic Sense and Set Rectifier for Improved Maximum-Power-Point Tracking in Piezoelectric Harvesting with 541% Energy Extraction Gain.
Proceedings of the IEEE International Solid- State Circuits Conference, 2019

A 142nW Voice and Acoustic Activity Detection Chip for mm-Scale Sensor Nodes Using Time-Interleaved Mixer-Based Frequency Scanning.
Proceedings of the IEEE International Solid- State Circuits Conference, 2019

IoT<sup>2</sup> - the Internet of Tiny Things: Realizing mm-Scale Sensors through 3D Die Stacking.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2019

2018
A 2.5nJ duty-cycled bridge-to-digital converter integrated in a 13mm<sup>3</sup> pressure-sensing system.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018

2017
A start-up boosting circuit with 133× speed gain for 2-transistor voltage reference.
Proceedings of the 2017 IEEE Custom Integrated Circuits Conference, 2017

2016
A 260µW infrared gesture recognition system-on-chip for smart devices.
Proceedings of the 2016 IEEE Symposium on VLSI Circuits, 2016

8.5 A 60%-efficiency 20nW-500µW tri-output fully integrated power management unit with environmental adaptation and load-proportional biasing for IoT systems.
Proceedings of the 2016 IEEE International Solid-State Circuits Conference, 2016

2015
A Dual-Slope Capacitance-to-Digital Converter Integrated in an Implantable Pressure-Sensing System.
IEEE J. Solid State Circuits, 2015

27.6 A 0.7pF-to-10nF fully digital capacitance-to-digital converter using iterative delay-chain discharge.
Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015

2014
An Ultra-Low Power Fully Integrated Energy Harvester Based on Self-Oscillating Switched-Capacitor Voltage Doubler.
IEEE J. Solid State Circuits, 2014

15.4b incremental sigma-delta capacitance-to-digital converter with zoom-in 9b asynchronous SAR.
Proceedings of the Symposium on VLSI Circuits, 2014

23.3 A 3nW fully integrated energy harvester based on self-oscillating switched-capacitor DC-DC converter.
Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014

Dual-slope capacitance to digital converter integrated in an implantable pressure sensing system.
Proceedings of the ESSCIRC 2014, 2014


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