Seungwon Lee

Orcid: 0000-0001-7022-7911

Affiliations:

Samsung Electronics, Suwon, Korea
Seoul National University, Korea (former)

According to our database¹, Seungwon Lee authored at least 8 papers between 2021 and 2026.

Collaborative distances:

Dijkstra number² of four.
Erdős number³ of four.

Timeline

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Book In proceedings Article PhD thesis Dataset Other

Bibliography

2026

PIM-SHERPA: Software Method for On-device LLM Inference by Resolving PIM Memory Attribute and Layout Inconsistencies.

[BibT_eX]

[DOI]

CoRR, March, 2026

2024

The Breakthrough Memory Solutions for Improved Performance on LLM Inference.

[BibT_eX]

[DOI]

IEEE Micro, 2024

2023

Samsung PIM/PNM for Transfmer Based AI : Energy Efficiency on PIM/PNM Cluster.

[BibT_eX]

[DOI]

Proceedings of the 35th IEEE Hot Chips Symposium, 2023

2022

Aquabolt-XL HBM2-PIM, LPDDR5-PIM With In-Memory Processing, and AXDIMM With Acceleration Buffer.

[BibT_eX]

[DOI]

IEEE Micro, 2022

2021

9.5 A 6K-MAC Feature-Map-Sparsity-Aware Neural Processing Unit in 5nm Flagship Mobile SoC.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Solid-State Circuits Conference, 2021

Hardware Architecture and Software Stack for PIM Based on Commercial DRAM Technology : Industrial Product.

[BibT_eX]

[DOI]

Proceedings of the 48th ACM/IEEE Annual International Symposium on Computer Architecture, 2021

Sparsity-Aware and Re-configurable NPU Architecture for Samsung Flagship Mobile SoC.

[BibT_eX]

[DOI]

Proceedings of the 48th ACM/IEEE Annual International Symposium on Computer Architecture, 2021

Aquabolt-XL: Samsung HBM2-PIM with in-memory processing for ML accelerators and beyond.

[BibT_eX]

[DOI]

Proceedings of the IEEE Hot Chips 33 Symposium, 2021

Seungwon Lee

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Bibliography

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