Sri M. Sri-Jayantha

According to our database, Sri M. Sri-Jayantha authored at least 5 papers between 2005 and 2008.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2008

Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy.

Lorenzo Valdevit, V. Khanna, Arun Sharma, Sri M. Sri-Jayantha, David L. Questad, K. Sikka

Microelectron. Reliab., 2008

Thermomechanical modeling of 3D electronic packages.

Sri M. Sri-Jayantha, Gerald McVicker, Kerry Bernstein, John U. Knickerbocker

IBM J. Res. Dev., 2008

Three-dimensional silicon integration.

John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright

IBM J. Res. Dev., 2008

2007

Multirate controller for Dual actuated servomechanism in Hard Disk Drive.

Abdullah Al Mamun, T. Suthasun, Sri M. Sri-Jayantha, Tong Heng Lee

Control. Intell. Syst., 2007

2005

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.

John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang

IBM J. Res. Dev., 2005