Bing Dang

According to our database1, Bing Dang authored at least 14 papers between 2005 and 2023.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2023
Health Guardian: Using Multi-modal Data to Understand Individual Health.
Proceedings of the IEEE International Conference on Digital Health, 2023

A Versatile Data Fabric for Advanced IoT-Based Remote Health Monitoring.
Proceedings of the IEEE International Conference on Digital Health, 2023

2022
Health Guardian Platform: A technology stack to accelerate discovery in Digital Health research.
Proceedings of the IEEE International Conference on Digital Health, 2022

2021
Development of a Smart Sleep Mask with Multiple Sensors.
Proceedings of the 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2021

2020
NOx Emission Flux Measurements with Multiple Mobile-DOAS Instruments in Beijing.
Remote. Sens., 2020

2015
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors.
Proceedings of the Symposium on VLSI Circuits, 2015

2012
An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects.
IEEE J. Solid State Circuits, 2012

2008
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections.
IBM J. Res. Dev., 2008

Three-dimensional silicon integration.
IBM J. Res. Dev., 2008

3D chip stacking with C4 technology.
IBM J. Res. Dev., 2008

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.
IBM J. Res. Dev., 2008

3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation.
Proceedings of the IEEE 2008 Custom Integrated Circuits Conference, 2008

2007
Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems.
Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, 2007

2005
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.
IBM J. Res. Dev., 2005


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