Tobias Stuckenberg
Orcid: 0000-0002-9245-3167
According to our database1,
Tobias Stuckenberg authored at least 10 papers
between 2018 and 2026.
Collaborative distances:
Collaborative distances:
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Bibliography
2026
Int. J. Parallel Program., September, 2026
2023
Design and Evaluation of a 180 nm Powerline Communication ASIC for Harsh Environment.
Microprocess. Microsystems, March, 2023
High Performance Instruction Fetch Structure within a RISC-V Processor for Use in Harsh Environments.
Proceedings of the Embedded Computer Systems: Architectures, Modeling, and Simulation, 2023
ZuSE Ki-Avf: Application-Specific AI Processor for Intelligent Sensor Signal Processing in Autonomous Driving.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2023
2021
Evaluation of Different Processor Architecture Organizations for On-Site Electronics in Harsh Environments.
Int. J. Parallel Program., 2021
Proceedings of the IEEE Nordic Circuits and Systems Conference, NorCAS 2021, Oslo, 2021
2020
DIY Smart Home: The Development of an Exemplary Internet of Things Infrastructure for Computer Science Education.
Proceedings of the 2020 ACM Conference on Innovation and Technology in Computer Science Education, 2020
2019
Design and Optimization of an ARM Cortex-M Based SoC for TCP/IP Communication in High Temperature Applications.
Proceedings of the Embedded Computer Systems: Architectures, Modeling, and Simulation, 2019
Evaluation of Different Processor Architecture Organizations for On-site Electronics in Harsh Environments.
Proceedings of the Embedded Computer Systems: Architectures, Modeling, and Simulation, 2019
2018
J. Commun., 2018