Jens Benndorf

According to our database, Jens Benndorf authored at least 9 papers between 2022 and 2025.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2025

SmartHeaP- A High-Level Programmable and Customized Hearing Aid System on Chip Integrated in a Research Hearing Aid Prototype.

Jens Karrenbauer, Sven Schönewald, Simon C. Klein, Frederik Kautz, Kamil Adiloglu, Claudia Kretzschmar, Tobias Bruns, Hans-Martin Bluethgen, Meinolf Blawat, Jens Benndorf, Holger Blume

IEEE Trans. Biomed. Circuits Syst., June, 2025

ZuSE-KI-Mobil: AI Chip Design Platform for Automotive and Industrial Applications.

Shaown Mojumder, Simon Friedrich, Emil Matús, Matthias Lüders, Martin Friedrich, Oliver Renke, Holger Blume, Markus Kock, Gregor Schewior, Darius Grantz, Jens Benndorf, Julian Höfer, Patrick Schmidt, Jürgen Becker, Nael Fasfous, Pierpaolo Morì, Hans-Jörg Vögel, Samira Ahmadifarsani, Leonidas Kontopoulos, Ulf Schlichtmann, Yun-Jin Li, Gerhard P. Fettweis

IEEE Trans. Very Large Scale Integr. Syst., 2025

2024

ZuSE-KI-Mobil AI Chip Design Platform: An Overview.

Shaown Mojumder, Simon Friedrich, Emil Matús, Gerhard P. Fettweis, Matthias Lüders, Martin Friedrich, Oliver Renke, Holger Blume, Julian Höfer, Patrick Schmidt, Jürgen Becker, Darius Grantz, Markus Kock, Jens Benndorf, Nael Fasfous, Pierpaolo Morì, Hans-Jörg Vögel, Samira Ahmadifarsani, Leonidas Kontopoulos, Ulf Schlichtmann, Kay Bierzynski

Proceedings of the 2024 IEEE Nordic Circuits and Systems Conference (NorCAS), 2024

A 22 nm 10 TOPS Mixed-Precision Neural Network SoC for Image Processing with Energy-Efficient Dilated Convolution Support.

Simon Friedrich, Robert Wittig, Emil Matús, Darius Grantz, Martin Zeller, Jens Benndorf, Gerhard P. Fettweis

Proceedings of the IEEE Symposium in Low-Power and High-Speed Chips, 2024

2023

An Automotive Vision SoC Platform from IVI to AD Level 4.

Kevin Wohnrade, Darius Grantz, Martin Zeller, Jens Benndorf

Proceedings of the 36th IEEE International System-on-Chip Conference, 2023

A High-Performance, Low Power Research Hearing Aid featuring a High-Level Programmable Custom 22nm FDSOI SoC.

Jens Karrenbauer, Sven Schönewald, Simon C. Klein, Meinolf Blawat, Jens Benndorf, Holger Blume

Proceedings of the 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2023

ZuSE Ki-Avf: Application-Specific AI Processor for Intelligent Sensor Signal Processing in Autonomous Driving.

Gia Bao Thieu, Sven Gesper, Guillermo Payá-Vayá, Christoph Riggers, Oliver Renke, Till Fiedler, Jakob Marten, Tobias Stuckenberg, Holger Blume, Christian Weis, Lukas Steiner, Chirag Sudarshan, Norbert Wehn, Lennart M. Reimann, Rainer Leupers, Michael Beyer, Daniel Köhler, Alisa Jauch, Jan Micha Borrmann, Setareh Jaberansari, Tim Berthold, Meinolf Blawat, Markus Kock, Gregor Schewior, Jens Benndorf, Frederik Kautz, Hans-Martin Blüthgen, Christian Sauer

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2023

The ZuSE-KI-Mobil AI Accelerator SoC: Overview and a Functional Safety Perspective.

Fabian Kempf, Julian Höfer, Tanja Harbaum, Jürgen Becker, Nael Fasfous, Alexander Frickenstein, Hans-Jörg Vögel, Simon Friedrich, Robert Wittig, Emil Matús, Gerhard P. Fettweis, Matthias Lüders, Holger Blume, Jens Benndorf, Darius Grantz, Martin Zeller, Dietmar Engelke, Karl-Heinz Eickel

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2023

2022

SmartHeaP - A High-level Programmable, Low Power, and Mixed-Signal Hearing Aid SoC in 22nm FD-SOI.

Jens Karrenbauer, Simon C. Klein, Sven Schönewald, Lukas Gerlach, Meinolf Blawat, Jens Benndorf, Holger Blume

Proceedings of the 48th IEEE European Solid State Circuits Conference, 2022