Jens Benndorf

According to our database, Jens Benndorf authored at least 5 papers between 2022 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2023

An Automotive Vision SoC Platform from IVI to AD Level 4.

Kevin Wohnrade, Darius Grantz, Martin Zeller, Jens Benndorf

Proceedings of the 36th IEEE International System-on-Chip Conference, 2023

A High-Performance, Low Power Research Hearing Aid featuring a High-Level Programmable Custom 22nm FDSOI SoC.

Jens Karrenbauer, Sven Schönewald, Simon C. Klein, Meinolf Blawat, Jens Benndorf, Holger Blume

Proceedings of the 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2023

ZuSE Ki-Avf: Application-Specific AI Processor for Intelligent Sensor Signal Processing in Autonomous Driving.

Gia Bao Thieu, Sven Gesper, Guillermo Payá Vayá, Christoph Riggers, Oliver Renke, Till Fiedler, Jakob Marten, Tobias Stuckenberg, Holger Blume, Christian Weis, Lukas Steiner, Chirag Sudarshan, Norbert Wehn, Lennart M. Reimann, Rainer Leupers, Michael Beyer, Daniel Köhler, Alisa Jauch, Jan Micha Borrmann, Setareh Jaberansari, Tim Berthold, Meinolf Blawat, Markus Kock, Gregor Schewior, Jens Benndorf, Frederik Kautz, Hans-Martin Blüthgen, Christian Sauer

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2023

The ZuSE-KI-Mobil AI Accelerator SoC: Overview and a Functional Safety Perspective.

Fabian Kempf, Julian Höfer, Tanja Harbaum, Jürgen Becker, Nael Fasfous, Alexander Frickenstein, Hans-Jörg Vögel, Simon Friedrich, Robert Wittig, Emil Matús, Gerhard P. Fettweis, Matthias Lüders, Holger Blume, Jens Benndorf, Darius Grantz, Martin Zeller, Dietmar Engelke, Karl-Heinz Eickel

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2023

2022

SmartHeaP - A High-level Programmable, Low Power, and Mixed-Signal Hearing Aid SoC in 22nm FD-SOI.

Jens Karrenbauer, Simon C. Klein, Sven Schönewald, Lukas Gerlach, Meinolf Blawat, Jens Benndorf, Holger Blume

Proceedings of the 48th IEEE European Solid State Circuits Conference, 2022