Yuxuan Zhao

Orcid: 0000-0001-5995-4763

Affiliations:
  • Chinese University of Hong Kong, Department of Computer Science and Engineering, Hong Kong


According to our database1, Yuxuan Zhao authored at least 19 papers between 2022 and 2026.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2026
DeepVerifier: Learning to Update Test Sequences for Coverage-Guided Verification.
ACM Trans. Design Autom. Electr. Syst., July, 2026

PPD: A Portable and Highly Parallel Dispatching System for Deep Learning.
ACM Trans. Design Autom. Electr. Syst., March, 2026

RegPlace: Regularity-Aware Placement for Full-System DNN Accelerator Designs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., February, 2026

IncreMacro-3D: Incremental Macro Placement for Face-to-Face Stacked Memory-on-Logic 3D ICs.
Proceedings of the Design, Automation & Test in Europe Conference, 2026

HPPlacer: A High-Precision Slack-Aware Global Placement Engine.
Proceedings of the Design, Automation & Test in Europe Conference, 2026

DPO-3D: Differentiable Power Delivery Network Optimization via Flexible Modeling for Routability and IR-Drop Tradeoff in Face-to-Face 3D ICs.
Proceedings of the 31st Asia and South Pacific Design Automation Conference, 2026

2025
Evolution of Optimization Algorithms for Global Placement via Large Language Models.
CoRR, April, 2025

Analytical Heterogeneous Die-to-Die 3-D Placement With Macros.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., February, 2025

Invited: Physical Design for Advanced 3D ICs: Challenges and Solutions.
Proceedings of the 2025 International Symposium on Physical Design, 2025

H3D: Heterogeneous Resources Aware Global Router for Face-to-Face Bonded 3D ICs.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025

Ultrafast Density Gradient Accumulation in 3D Analytical Placement with Divergence Theorem.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025

3D-Flow: Flow-based Standard Cell Legalization for 3D ICs.
Proceedings of the 62nd ACM/IEEE Design Automation Conference, 2025

A Systematic Approach for Multi-objective Double-side Clock Tree Synthesis.
Proceedings of the 62nd ACM/IEEE Design Automation Conference, 2025

2024
Analytical Die-to-Die 3-D Placement With Bistratal Wirelength Model and GPU Acceleration.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., June, 2024

Analytical Heterogeneous Die-to-Die 3D Placement with Macros.
CoRR, 2024

2023
Analytical Die-to-Die 3D Placement with Bistratal Wirelength Model and GPU Acceleration.
CoRR, 2023

AutoGraph: Optimizing DNN Computation Graph for Parallel GPU Kernel Execution.
Proceedings of the Thirty-Seventh AAAI Conference on Artificial Intelligence, 2023

2022
Mixed-Cell-Height Legalization on CPU-GPU Heterogeneous Systems.
Proceedings of the 2022 Design, Automation & Test in Europe Conference & Exhibition, 2022

GTuner: tuning DNN computations on GPU via graph attention network.
Proceedings of the DAC '22: 59th ACM/IEEE Design Automation Conference, San Francisco, California, USA, July 10, 2022


  Loading...