Andrea Vici

According to our database, Andrea Vici authored at least 5 papers between 2019 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations.

Andrea Vici, Robin Degraeve, Philippe J. Roussel, Jacopo Franco, Ben Kaczer, Ingrid De Wolf

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Using dedicated device arrays for the characterization of TDDB in a scaled HK/MG technology.

Pablo Saraza-Canflanca, Javier Diaz-Fortuny, Andrea Vici, Erik Bury, Robin Degraeve, Ben Kaczer

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Combining SILC and BD statistics for low-voltage lifetime projection in HK/MG stacks.

Andrea Vici, Robin Degraeve, João Pedro Bastos, Philippe Roussel, Ingrid De Wolf

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress.

Kookjin Lee, Ben Kaczer, Anastasiia Kruv, Mario Gonzalez, Geert Eneman, Oguzhan O. Okudur, Alexander Grill, Jacopo Franco, Andrea Vici, Robin Degraeve, Ingrid De Wolf

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2019

Generation of oxide traps in Back-Side-Illuminated CMOS Image Sensors and impact on reliability.

Andrea Vici, Felice Russo, Nicola Lovisi, Aldo Marchioni, Antonio Casella, Fernanda Irrera

Proceedings of the 49th European Solid-State Device Research Conference, 2019