Chang Liu

According to our database, Chang Liu authored at least 11 papers between 2010 and 2016.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2016

Full-Chip Signal Integrity Analysis and Optimization of 3-D ICs.

Taigon Song, Chang Liu, Yarui Peng, Sung Kyu Lim

IEEE Trans. Very Large Scale Integr. Syst., 2016

2015

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).

Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim

IEEE Trans. Computers, 2015

2013

Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs.

Taigon Song, Chang Liu, Yarui Peng, Sung Kyu Lim

Proceedings of the 50th Annual Design Automation Conference 2013, 2013

2012

3D-MAPS: 3D Massively parallel processor with stacked memory.

Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim

Proceedings of the 2012 IEEE International Solid-State Circuits Conference, 2012

A design tradeoff study with monolithic 3D integration.

Chang Liu, Sung Kyu Lim

Proceedings of the Thirteenth International Symposium on Quality Electronic Design, 2012

2011

Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs.

Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon

Proceedings of the 12th International Symposium on Quality Electronic Design, 2011

Signal integrity analysis and optimization for 3D ICs.

Chang Liu, Taigon Song, Sung Kyu Lim

Proceedings of the 12th International Symposium on Quality Electronic Design, 2011

Variation-aware clock network design methodology for ultra-low voltage (ULV) circuits.

Xin Zhao, Jeremy R. Tolbert, Chang Liu, Saibal Mukhopadhyay, Sung Kyu Lim

Proceedings of the 2011 International Symposium on Low Power Electronics and Design, 2011

Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC.

Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim

Proceedings of the 48th Design Automation Conference, 2011

2010

Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system.

Minki Cho, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Saibal Mukhopadhyay

Proceedings of the 2010 International Conference on Computer-Aided Design, 2010

Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory.

Michael B. Healy, Krit Athikulwongse, Rohan Goel, Mohammad M. Hossain, Dae Hyun Kim, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Moongon Jung, Brian Ouellette, Mohit Pathak, Hemant Sane, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim

Proceedings of the IEEE Custom Integrated Circuits Conference, 2010