Krit Athikulwongse

According to our database, Krit Athikulwongse authored at least 20 papers between 1997 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

Implementation of and Experimentation with Ground-Penetrating Radar for Real-Time Automatic Detection of Buried Improvised Explosive Devices.

Pachara Srimuk, Akkarat Boonpoonga, Kamol Kaemarungsi, Krit Athikulwongse, Sitthichai Dentri

Sensors, 2022

2021

Improved Step Detection with Smartphone Handheld Mode Recognition.

Warnnaphorn Suksuganjana, Seksan Laitrakun, Krit Athikulwongse, Yuko Hara-Azumi, Somrudee Deepaisarn

Proceedings of the 13th International Conference on Knowledge and Smart Technology, 2021

2020

Mapping the Physical and Dielectric Properties of Layered Soil Using Short-Time Matrix Pencil Method-Based Ground-Penetrating Radar.

Nattawat Chantasen, Akkarat Boonpoonga, Krit Athikulwongse, Kamol Kaemarungsi, Prayoot Akkaraekthalin

IEEE Access, 2020

2019

High Performance Application Specific Stream Architecture for Hardware Acceleration of HOG-SVM on FPGA.

Piyumal Ranawaka, Mongkol Ekpanyapong, Adriano Tavares, Mathew Dailey, Krit Athikulwongse, Vitor Alberto Silva

IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2019

Application Specific Architecture for Hardware Accelerating HOG-SVM to Achieve High Throughput on HD Frames.

Piyumal Ranawaka, Mongkol Ekpanyapong, Adriano Tavares, Jorge Cabral, Krit Athikulwongse, Vitor Alberto Silva

Proceedings of the 30th IEEE International Conference on Application-specific Systems, 2019

2016

Fast bidirectional shortest path on GPU.

Lalinthip Tangjittaweechai, Mongkol Ekpanyapong, Thaisiri Watewai, Krit Athikulwongse, Sung Kyu Lim, Adriano Tavares

IEICE Electron. Express, 2016

2015

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).

Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim

IEEE Trans. Computers, 2015

2014

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement.

Krit Athikulwongse, Mongkol Ekpanyapong, Sung Kyu Lim

IEEE Trans. Very Large Scale Integr. Syst., 2014

2013

Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout.

Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim

IEEE Trans. Very Large Scale Integr. Syst., 2013

Impact of Mechanical Stress on the Full Chip Timing for Through-Silicon-Via-based 3-D ICs.

Krit Athikulwongse, Jae-Seok Yang, David Z. Pan, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013

Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs.

Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, Sung Kyu Lim

Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013

2012

3D-MAPS: 3D Massively parallel processor with stacked memory.

Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim

Proceedings of the 2012 IEEE International Solid-State Circuits Conference, 2012

Exploiting die-to-die thermal coupling in 3D IC placement.

Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim

Proceedings of the 49th Annual Design Automation Conference 2012, 2012

Design for manufacturability and reliability for TSV-based 3D ICs.

David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang

Proceedings of the 17th Asia and South Pacific Design Automation Conference, 2012

2010

Stress-driven 3D-IC placement with TSV keep-out zone and regularity study.

Krit Athikulwongse, Ashutosh Chakraborty, Jae-Seok Yang, David Z. Pan, Sung Kyu Lim

Proceedings of the 2010 International Conference on Computer-Aided Design, 2010

TSV stress aware timing analysis with applications to 3D-IC layout optimization.

Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee, Sung Kyu Lim, David Z. Pan

Proceedings of the 47th Design Automation Conference, 2010

Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory.

Michael B. Healy, Krit Athikulwongse, Rohan Goel, Mohammad M. Hossain, Dae Hyun Kim, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Moongon Jung, Brian Ouellette, Mohit Pathak, Hemant Sane, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim

Proceedings of the IEEE Custom Integrated Circuits Conference, 2010

Buffered clock tree sizing for skew minimization under power and thermal budgets.

Krit Athikulwongse, Xin Zhao, Sung Kyu Lim

Proceedings of the 15th Asia South Pacific Design Automation Conference, 2010

2009

A study of Through-Silicon-Via impact on the 3D stacked IC layout.

Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim

Proceedings of the 2009 International Conference on Computer-Aided Design, 2009

1997

An NTSC and PAL closed caption processor.

Sayan Teerapnyawatt, Krit Athikulwongse

Proceedings of the Field-Programmable Logic and Applications, 7th International Workshop, 1997