According to our database1, Moongon Jung authored at least 15 papers between 2010 and 2017.
Legend:Book In proceedings Article PhD thesis Other
IEEE Trans. Very Large Scale Integr. Syst., 2017
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).
IEEE Trans. Computers, 2015
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC.
Commun. ACM, 2014
Proceedings of the 51st Annual Design Automation Conference 2014, 2014
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013
Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2013
Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013
Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs.
Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013
TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012
Proceedings of the 2012 IEEE International Solid-State Circuits Conference, 2012
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs.
Proceedings of the 49th Annual Design Automation Conference 2012, 2012
Proceedings of the 17th Asia and South Pacific Design Automation Conference, 2012
Proceedings of the 2011 IEEE/ACM International Conference on Computer-Aided Design, 2011
Proceedings of the IEEE Custom Integrated Circuits Conference, 2010
Proceedings of the IEEE International Conference on 3D System Integration, 2010