Moongon Jung

According to our database, Moongon Jung authored at least 15 papers between 2010 and 2017.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2017

Design Methodologies for Low-Power 3-D ICs With Advanced Tier Partitioning.

Moongon Jung, Taigon Song, Yarui Peng, Sung Kyu Lim

IEEE Trans. Very Large Scale Integr. Syst., 2017

2015

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).

Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim

IEEE Trans. Computers, 2015

2014

TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC.

Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim

Commun. ACM, 2014

On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective.

Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim

Proceedings of the 51st Annual Design Automation Conference 2014, 2014

2013

Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations.

Moongon Jung, David Z. Pan, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013

Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives.

Chun Zhang, Moongon Jung, Sung Kyu Lim, Yiyu Shi

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2013

How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core.

Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim

Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013

Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs.

Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, Sung Kyu Lim

Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013

2012

TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC.

Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012

3D-MAPS: 3D Massively parallel processor with stacked memory.

Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim

Proceedings of the 2012 IEEE International Solid-State Circuits Conference, 2012

Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs.

Moongon Jung, David Z. Pan, Sung Kyu Lim

Proceedings of the 49th Annual Design Automation Conference 2012, 2012

Design for manufacturability and reliability for TSV-based 3D ICs.

David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang

Proceedings of the 17th Asia and South Pacific Design Automation Conference, 2012

2011

Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC.

Moongon Jung, Xi Liu, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim

Proceedings of the 2011 IEEE/ACM International Conference on Computer-Aided Design, 2011

2010

Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory.

Michael B. Healy, Krit Athikulwongse, Rohan Goel, Mohammad M. Hossain, Dae Hyun Kim, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Moongon Jung, Brian Ouellette, Mohit Pathak, Hemant Sane, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim

Proceedings of the IEEE Custom Integrated Circuits Conference, 2010

A study of IR-drop noise issues in 3D ICs with through-silicon-vias.

Moongon Jung, Sung Kyu Lim

Proceedings of the IEEE International Conference on 3D System Integration, 2010