Chenghu Dai

Orcid: 0009-0000-3347-3056

According to our database1, Chenghu Dai authored at least 25 papers between 2023 and 2025.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2025
A 28 nm Dual-Mode SRAM-CIM Macro With Local Computing Cell for CNNs and Grayscale Edge Detection.
IEEE Trans. Very Large Scale Integr. Syst., August, 2025

A 28-nm Cascode Current Mirror-Based Inconsistency-Free Charging-and-Discharging SRAM-CIM Macro for High-Efficient Convolutional Neural Networks.
IEEE Trans. Very Large Scale Integr. Syst., July, 2025

A 28-nm 9T1C SRAM-Based CIM Macro With Hierarchical Capacitance Weighting and Two-Step Capacitive Comparison ADCs for CNNs.
IEEE Trans. Very Large Scale Integr. Syst., July, 2025

8T-SRAM Computing-in-Memory Macro with Bitline Leakage Compensation.
Circuits Syst. Signal Process., July, 2025

High-Reliability and High-Throughput CIM 10T-SRAM for Multiplication and Accumulation Operations With 274.3 GOPS and 200-237.5 TOPS/W.
IEEE Trans. Very Large Scale Integr. Syst., April, 2025

A Low-Cost and Triple-Node-Upset Self-Recoverable Latch Design With Low Soft Error Rate.
IEEE Trans. Very Large Scale Integr. Syst., April, 2025

Real-time bit-line leakage balance circuit with four-input low-offset SA considering threshold voltage for SRAM stability design.
Int. J. Circuit Theory Appl., April, 2025

Hybrid MOSFET-TFET 11T SRAM cell with high write speed and free half-selected disturbance.
Microelectron. J., 2025

Low-power 12T TFET-MOSFET hybrid SRAM bitcell and hybrid 8T SRAM array based on multiplexing strategy.
Microelectron. J., 2025

A PVT-insensitive 7T SRAM CIM macro for multibit multiplication with dynamic matching quantization circuits.
Microelectron. J., 2025

TSCIM: A 28nm Transposed Stochastic CIM Macro for On-Chip Training and Inference.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2025

2024
High-Performance Latch Designs of Double-Node-Upset Self-Recovery and Triple-Node-Upset Tolerance for Aerospace Applications.
IEEE Trans. Aerosp. Electron. Syst., October, 2024

Low-Cost and Highly Robust Quadruple Node Upset Tolerant Latch Design.
IEEE Trans. Very Large Scale Integr. Syst., May, 2024

Soft-Error-Immune Quadruple-Node-Upset Tolerant Latch Based on Polarity Design and Source-Isolation Technologies.
IEEE Trans. Very Large Scale Integr. Syst., April, 2024

Flip Point Offset-Compensation Sense Amplifier With Sensing-Margin-Enhancement for Dynamic Random-Access Memory.
IEEE Trans. Circuits Syst. II Express Briefs, April, 2024

A 9T-SRAM in-memory computing macro for Boolean logic and multiply-and-accumulate operations.
Microelectron. J., February, 2024

A CFMB STT-MRAM-Based Computing-in-Memory Proposal With Cascade Computing Unit for Edge AI Devices.
IEEE Trans. Circuits Syst. I Regul. Pap., January, 2024

High energy efficient and configurable CIM macro for image processing.
Microelectron. J., 2024

Cross-coupled 4T2R multi-logic in-memory computing circuit design.
Microelectron. J., 2024

A 28-nm 9T SRAM-based CIM macro with capacitance weighting module and redundant array-assisted ADC.
Microelectron. J., 2024

Corrigendum to "A 9T-SRAM based computing-in-memory with redundant unit and digital operation for boolean logic and MAC" [145, March 2024, 106124.
Microelectron. J., 2024

A 9T-SRAM based computing-in-memory with redundant unit and digital operation for boolean logic and MAC.
Microelectron. J., 2024

2023
Design of radiation-hardened memory cell by polar design for space applications.
Microelectron. J., February, 2023

Bit-line leakage current tracking and self-compensation circuit for SRAM reliability design.
Microelectron. J., February, 2023

Radiation-hardened 14T SRAM cell by polar design for space applications.
IEICE Electron. Express, 2023


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