Chenghu Dai

According to our database1, Chenghu Dai authored at least 7 papers between 2023 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Links

On csauthors.net:

Bibliography

2024
Soft-Error-Immune Quadruple-Node-Upset Tolerant Latch Based on Polarity Design and Source-Isolation Technologies.
IEEE Trans. Very Large Scale Integr. Syst., April, 2024

Flip Point Offset-Compensation Sense Amplifier With Sensing-Margin-Enhancement for Dynamic Random-Access Memory.
IEEE Trans. Circuits Syst. II Express Briefs, April, 2024

A 9T-SRAM in-memory computing macro for Boolean logic and multiply-and-accumulate operations.
Microelectron. J., February, 2024

A CFMB STT-MRAM-Based Computing-in-Memory Proposal With Cascade Computing Unit for Edge AI Devices.
IEEE Trans. Circuits Syst. I Regul. Pap., January, 2024

2023
Design of radiation-hardened memory cell by polar design for space applications.
Microelectron. J., February, 2023

Bit-line leakage current tracking and self-compensation circuit for SRAM reliability design.
Microelectron. J., February, 2023

Radiation-hardened 14T SRAM cell by polar design for space applications.
IEICE Electron. Express, 2023


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