Fengman Liu

According to our database, Fengman Liu authored at least 6 papers between 2016 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures.

Yunting Liu, Rong Fu, Meiying Su, Jun Li, Chuan Chen, Fengman Liu

Microelectron. J., 2025

PDN analysis of 3D chiplet integration with a DC-DC converter on active interposer.

Chengyi Liao, Huimin He, Fengze Hou, Cheng Peng, Fengman Liu, Liqiang Cao

IEICE Electron. Express, 2025

2024

A 2T P-Channel Logic Flash Cell for Reconfigurable Interconnection in Chiplet-Based Computing-In-Memory Accelerators.

Weizeng Li, Linfang Wang, Zhi Li, Wang Ye, Zhidao Zhou, Haiyang Zhou, Hanghang Gao, Jinshan Yue, Hongyang Hu, Fengman Liu, Qing Luo, Chunmeng Dou

Proceedings of the IEEE International Symposium on Circuits and Systems, 2024

2022

Design of a PAM-4 VCSEL-Based Transceiver Front-End for Beyond-400G Short-Reach Optical Interconnects.

Jian He, Donglai Lu, Haiyun Xue, Sikai Chen, Han Liu, Leliang Li, Guike Li, Zhao Zhang, Jian Liu, Liyuan Liu, Nanjian Wu, Ningmei Yu, Fengman Liu, Xi Xiao, Yong Chen, Nan Qi

IEEE Trans. Circuits Syst. I Regul. Pap., 2022

2017

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate.

Cheng Chen, Fengze Hou, Fengman Liu, Qian She, Liqiang Cao, Lixi Wan

Microelectron. Reliab., 2017

2016

Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate.

Peng Wu, Fengze Hou, Cheng Chen, Jun Li, Fengman Liu, Jing Zhang, Liqiang Cao, Lixi Wan

Microelectron. Reliab., 2016