Hsin-Hung Kuo

According to our database, Hsin-Hung Kuo authored at least 4 papers between 2024 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

8.2 A 32Gb/s 12.35Tb/s/mm² 0.36pJ/b UCIe-Like Die-to-Die Interface Featuring Edge-Triggered Transceivers in 3nm with Active LSI Packaging.

Wei-Chih Chen, Mu-Shan Lin, Chien-Chun Tsai, Shenggao Li, Wei-Shuo Lin, Yu-Jie Huang, Nai-Chen Cheng, Yu-Chi Chen, Wen-Hung Huang, Chin-Hua Wen, Hsin-Hung Kuo, Han-Tzung Ke, Jie-Ren Huang, Chang-Yi Li, Sheng-Tsung Lai, Shu-Chun Yang, Kuan-Ting Chou, Pei-Chen Chiou, Tsung-Hsien Tsai, Yi-Ting Chen, Yen-Ming Chen, Kenny Cheng-Hsiang Hsieh

Proceedings of the IEEE International Solid-State Circuits Conference, 2026

2025

36.1 A 32Gb/s 10.5Tb/s/mm 0.6pJ/b UCIe-Compliant Low-Latency Interface in 3nm Featuring Matched-Delay for Dynamic Clock Gating.

Mu-Shan Lin, Chien-Chun Tsai, Shenggao Li, Wei-Chih Chen, Wen-Hung Huang, Yu-Chi Chen, Yu-Jie Huang, Alan J. Drake, Chin-Hua Wen, Paul Ranucci, Hsin-Hung Kuo, Aidong Yin, Shu-Chun Yang, Farsheed Mahmoudi, Han-Tzung Ke, Chao-Chieh Li, Nai-Chen Cheng, Jimmy Wang, Kevin Lin, Harry Liao, Jie-Ren Huang, Meng-Hsuan Wu, Kenny Cheng-Hsiang Hsieh, Nicholas Amatruda, William Polanco, David King, Todd Basso, Anwar Kashem

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

UCle-Compliant Chiplet Interconnect Design Leveraging Cutting-Edge Packaging Technologies.

Yu-Jie Huang, Mu-Shan Lin, Chien-Chun Tsai, Wei-Chih Chen, Hsin-Hung Kuo, Shu-Chun Yang, Shenggao Li

Proceedings of the IEEE Custom Integrated Circuits Conference, 2025

2024

A 0.296pJ/bit 17.9Tb/s/mm² Die-to-Die Link in 5nm/6nm FinFET on a 9μm-Pitch 3D Package Achieving 10.24Tb/s Bandwidth at 16Gb/s PAM-4.

Mu-Shan Lin, Chien-Chun Tsai, Shenggao Li, Tze-Chiang Huang, Wen-Hung Huang, Kate Huang, Yu-Chi Chen, Alex Liu, Yu-Jie Huang, Jimmy Wang, Shu-Chun Yang, Nai-Chen Cheng, Chao-Chieh Li, Hsin-Hung Kuo, Wei-Chih Chen, Chin-Hua Wen, Kevin Lin, Po-Yi Huang, Kenny Cheng-Hsiang Hsieh, Frank Lee

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024