Tze-Chiang Huang

According to our database, Tze-Chiang Huang authored at least 4 papers between 2013 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2020

A 7-nm 4-GHz Arm¹-Core-Based CoWoS¹ Chiplet Design for High-Performance Computing.

Mu-Shan Lin, Tze-Chiang Huang, Chien-Chun Tsai, King-Ho Tam, Kenny Cheng-Hsiang Hsieh, Ching-Fang Chen, Wen-Hung Huang, Chi-Wei Hu, Yu-Chi Chen, Sandeep Kumar Goel, Chin-Ming Fu, Stefan Rusu, Chao-Chieh Li, Sheng-Yao Yang, Mei Wong, Shu-Chun Yang, Frank Lee

IEEE J. Solid State Circuits, 2020

2019

A 7nm 4GHz Arm^®-core-based CoWoS^® Chiplet Design for High Performance Computing.

Mu-Shan Lin, Tze-Chiang Huang, Chien-Chun Tsai, King-Ho Tam, Kenny Cheng-Hsiang Hsieh, Tom Chen, Wen-Hung Huang, Jack Hu, Yu-Chi Chen, Sandeep Kumar Goel, Chin-Ming Fu, Stefan Rusu, Chao-Chieh Li, Sheng-Yao Yang, Mei Wong, Shu-Chun Yang, Frank Lee

Proceedings of the 2019 Symposium on VLSI Circuits, Kyoto, Japan, June 9-14, 2019, 2019

2014

A 1 Tbit/s Bandwidth 1024 b PLL/DLL-Less eDRAM PHY Using 0.3 V 0.105 mW/Gbps Low-Swing IO for CoWoS Application.

Mu-Shan Lin, Chien-Chun Tsai, Chih-Hsien Chang, Wen-Hung Huang, Ying-Yu Hsu, Shu-Chun Yang, Chin-Ming Fu, Mao-Hsuan Chou, Tien-Chien Huang, Ching-Fang Chen, Tze-Chiang Huang, Saman Adham, Min-Jer Wang, William Wu Shen, Ashok Mehta

IEEE J. Solid State Circuits, 2014

2013

Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study.

Sandeep Kumar Goel, Saman Adham, Min-Jer Wang, Ji-Jan Chen, Tze-Chiang Huang, Ashok Mehta, Frank Lee, Vivek Chickermane, Brion L. Keller, Thomas Valind, Subhasish Mukherjee, Navdeep Sood, Jeongho Cho, Hayden Hyungdong Lee, Jungi Choi, Sangdoo Kim

Proceedings of the 2013 IEEE International Test Conference, 2013