Robert Patti

According to our database, Robert Patti authored at least 10 papers between 2011 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Advanced Packaging, Heterogeneous Integration, and Foundry 2.0.

Robert Patti

Proceedings of the 67th IEEE International Midwest Symposium on Circuits and Systems, 2024

2023

A Sub-500fJ/bit 3D Direct Bond Silicon Photonic Transceiver in 12nm FinFET.

Po-Hsuan Chang, Anirban Samanta, Peng Yan, Mingye Fu, Yu Zhang, Mehmet Berkay On, Ankur Kumar, Hyungryul Kang, Il-Min Yi, Dedeepya Annabattuni, David Scott, Robert Patti, Yang-Hang Fan, Yuanming Zhu, S. J. Ben Yoo, Samuel Palermo

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit.

Anirban Samanta, Po-Hsuan Chang, Peng Yan, Mingye Fu, Mehmet Berkay On, Ankur Kumar, Hyungryul Kang, Il-Min Yi, Dedeepya Annabattuni, Yu Zhang, David Scott, Robert Patti, Yang-Hang Fan, Yuanming Zhu, Samuel Palermo, S. J. Ben Yoo

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023

2022

Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning.

Theodros Nigussie, Joshua Schabel, Steve Lipa, Lisa G. McIlrath, Robert Patti, Paul D. Franzon

IEEE Trans. Very Large Scale Integr. Syst., 2022

2021

Multi-ANN embedded system based on a custom 3D-DRAM.

Lee Baker, Robert Patti, Paul D. Franzon

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2015

Invited talk: Progress in 3D integrated circuits.

Robert Patti

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Exploring DRAM organizations for energy-efficient and resilient exascale memories.

Bharan Giridhar, Michael Cieslak, Deepankar Duggal, Ronald G. Dreslinski, Hsing Min Chen, Robert Patti, Betina Hold, Chaitali Chakrabarti, Trevor N. Mudge, David T. Blaauw

Proceedings of the International Conference for High Performance Computing, 2013

2012

3D integrated circuits: Designing in a new dimension: Designer track.

Robert Patti

Proceedings of the 2012 IEEE/ACM International Conference on Computer-Aided Design, 2012

2011

Advances in 3D integrated circuits.

Robert Patti

Proceedings of the 2011 International Symposium on Physical Design, 2011

Interconnect design and analysis for Through Silicon Interposers (TSIs).

Joseph Romen Cubillo, Roshan Weerasekera, Zaw Zaw Oo, En-Xiao Liu, Bob Conn, Surya Bhattacharya, Robert Patti

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011